Examining, analyzing and/or processing an object using an object receiving container

ABSTRACT

An object receiving container may receive an object which is examinable, analyzable and/or processable at cryo-temperatures. An object holding system may comprise an object receiving container. A beam apparatus or an apparatus for processing an object may comprise an object receiving container or an object holding system. An object may be examined, analyzed and/or processed using an object receiving container or an object holding system. The object receiving container may comprise a first container unit, a cavity for receiving the object, a second container unit, which is able to be brought into a first position and/or into a second position relative to the first container unit, and at least one fastening device which is arranged at the first container unit or at the second container unit for arranging the object receiving container at a holding device.

CROSS-REFERENCE TO RELATED APPLICATION

This application claims the priority of the German patent applicationNo. 10 2020 102 314.6, filed on Jan. 30, 2020, which is incorporatedherein by reference.

TECHNICAL FIELD

The system described herein relates to an object receiving container forreceiving at least one object which is examinable, analyzable and/orprocessable at cryo-temperatures. Further, the system described hereinrelates to an object holding system comprising an object receivingcontainer. Moreover, the system described herein relates to a beamapparatus and/or an apparatus for processing an object, comprising anobject receiving container or comprising an object holding system. Byway of example, the beam apparatus is embodied as a light beam apparatusand/or as a particle beam apparatus and/or as an x-ray beam apparatus.By way of example, the apparatus for processing the object is amicrotome. Further, the system described herein relates to a method forexamining, analyzing and/or processing an object using an objectreceiving container or an object holding system.

BACKGROUND OF THE INVENTION

The practice of examining and/or analyzing objects by light microscopyhas been known for a long time. In light microscopy, use is made of alight microscope which may comprise a beam generator for generating alight beam, an objective lens for focusing the light beam onto theobject and a display device for displaying an image and/or an analysisof the object. By way of example, the display device is embodied as aneyepiece.

Further, the practice of examining objects with electron beamapparatuses has been known for a long time. By way of example, electronbeam apparatuses, in particular a scanning electron microscope (alsoreferred to as SEM below) and/or a transmission electron microscope(also referred to as TEM below), are used to examine objects (samples)in order to obtain knowledge in respect of the properties and thebehavior under certain conditions.

In an SEM, an electron beam (also referred to as primary electron beambelow) is generated by means of a beam generator and focused onto anobject to be examined by way of a beam guiding system. The primaryelectron beam is guided in a scanning manner over a surface of theobject to be examined by means of a deflection device in the form of ascanning device. Here, the electrons of the primary electron beam mayinteract with the object to be examined. As a consequence of theinteraction, in particular, electrons are emitted by the object(so-called secondary electrons) and electrons of the primary electronbeam are backscattered (so-called backscattered electrons). Thesecondary electrons and backscattered electrons are detected and usedfor image generation. An imaging of the object to be examined is thusobtained.

In the case of a TEM, a primary electron beam is likewise generated bymeans of a beam generator and guided onto an object to be examined bymeans of a beam guiding system. The primary electron beam may passthrough the object to be examined. When the primary electron beam passesthrough the object to be examined, the electrons of the primary electronbeam may interact with the material of the object to be examined. Theelectrons passing through the object to be examined are imaged onto aluminescent screen or onto a detector (for example a camera) by a systemconsisting of an objective and a projection unit. Here, imaging may alsotake place in the scanning mode of a TEM. As a rule, such a TEM isreferred to as STEM. Additionally, provision can be made for detectingelectrons backscattered at the object to be examined and/or secondaryelectrons emitted by the object to be examined by means of a furtherdetector in order to image an object to be examined.

Furthermore, it is known from the prior art to use combinationapparatuses for examining objects, wherein both electrons and ions canbe guided onto an object to be examined. By way of example, it is knownto equip an SEM additionally with an ion beam column. An ion beamgenerator arranged in the ion beam column may generate ions that areused for preparing an object (for example removing material of theobject or applying material to the object) or else for imaging. For thispurpose, the ions are scanned over the object by means of a deflectiondevice in the form of a scanning device. The SEM may serve here inparticular for observing the preparation, but also for furtherexamination of the prepared or unprepared object.

The practice of arranging an object to be examined with a particle beamapparatus on an object holder, which in turn is arranged on an objectstage, is known. The object stage is arranged in a sample chamber of theparticle beam apparatus. The object stage has a movable embodiment, themovable embodiment of the object stage being ensured by a plurality ofmovement units, from which the object stage is assembled. The movementunits facilitate a movement of the object stage in at least onespecified direction. Object stages that have a plurality oftranslational movement units (e.g., approximately 3 to 4 translationalmovement units) and a plurality of rotational movement units (e.g., 2 to3 rotational movement units), in particular, are known. By way ofexample, an object stage which is movably arranged along a firsttranslation axis (for example, an x-axis), along a second translationaxis (for example, a y-axis), and along a third translation axis (forexample, a z-axis) is known. The first translation axis, the secondtranslation axis and the third translation axis are orientedperpendicular to one another. Further, the known object stage isembodied to be rotatable about a first axis of rotation and about asecond axis of rotation, which is aligned perpendicular to the firstaxis of rotation.

The driving force for a movement by means of the movement units isprovided by stepper motors in the prior art. A respective stepper motoris provided for a respective movement along one of the translation axesor for a rotation about one of the axes of rotation. The stepper motorsare arranged in the sample chamber of the particle beam apparatus oroutside of the sample chamber of the particle beam apparatus. In thelatter case, vacuum feed-throughs and mechanical devices are provided toensure the actuation of the object stage by the stepper motors.

The prior art has further disclosed the examination of a frozen objectusing a light microscope and/or a particle beam apparatus. By way ofexample, this is advantageous when examining biological objects. To thisend, the frozen object is arranged on an object holder, which is able tobe cooled. By way of example, the object holder is able to be cooled toa temperature of −140° C. or less than −140° C. using liquid nitrogen orliquid helium. Both above and below, temperatures of below −50° C. arereferred to as cryo-temperatures. The aforementioned object holder isarranged at the object stage of a light microscope or a particle beamapparatus.

By way of example, object holders are known from DE 11 2010 001 712 B4and CN 209388997 U.

The practice of examining, analyzing and/or processing a frozen objectusing not only one apparatus but multiple apparatuses is known. By wayof example, the frozen object is initially examined and/or processedusing a light microscope and subsequently examined and/or processedusing an SEM and/or an ion beam apparatus. In the process, it isnecessary to ensure that the frozen object, which is arranged at anobject holder, is safely transported from a first apparatus to a secondapparatus. Further, it is necessary to ensure that the object holderfacilitates, over a relatively long period of time, for example over aplurality of days or months, a secure storage of the frozen object to beexamined. The above statement additionally or alternatively also appliesto apparatuses used to mechanically process a frozen object, for examplea microtome and/or a laser beam apparatus for cutting the frozen object.The above statement further additionally or alternatively applies toapparatuses used to apply layers to a frozen object, for example asputtering apparatus for applying layers or an apparatus for electronbeam-induced deposition of layers, for example using a gas, or for ionbeam-induced deposition of layers, for example using a gas.

However, it was found that there always is the risk of a frozen objectbeing contaminated during the examination, the analysis, the processingand/or a transportation of said frozen object, for example by thedeposition of atmospheric water on the frozen object. There also is therisk of water deposition on a frozen object when the frozen object isstored, for example, in liquid nitrogen, in particular as a result of adeposition of water crystals, which swim in the liquid nitrogen, on theobject to be examined. Contaminations can also be deposited on a frozenobject in the case where the fully prepared frozen object remains in asample chamber of a beam apparatus for a relatively long period of time.A layer of water forming on the frozen object makes an examination, ananalysis and/or processing of the frozen object with a light microscopeand/or a particle beam apparatus more difficult.

Moreover, it is known that light microscopes and/or particle beamapparatuses from different manufacturers respectively require veryspecific configurations of an object holder; otherwise, the objectholder cannot be arranged at a certain light microscope or in the samplechamber of a specific particle beam apparatus. Expressed differently, afirst object holder, for example, provided for a first particle beamapparatus is not suitable for reception in a second particle beamapparatus or in a light microscope on account of the physicalconfiguration of said object holder. In this case, the prior artprovides for a frozen object to be examined to be removed from the firstobject holder and to be arranged at a second object holder which, onaccount of the physical configuration thereof, is suitable for receptionin the second particle beam apparatus or in the light microscope. Thisis quite inconvenient and often leads to, firstly, a contamination ofthe object and, secondly, damage to the object. Further, it was foundthat maintaining the orientation of a frozen object, which may beimportant for examining and processing the frozen object, is onlypossible with great difficulties.

It therefore may be desirable to have a device for holding andtransporting a frozen object, which allows safe and simpletransportation between two examination apparatuses and which is able tobe arranged in as many different examination apparatuses and/orprocessing apparatuses as possible. Further, the device shouldfacilitate secure storage of the frozen object.

SUMMARY OF THE INVENTION

In some embodiments of the system described herein, the object receivingcontainer is configured to receive at least one object which isexaminable, analyzable and/or processable at cryo-temperatures. Theobject receiving container may comprise at least one first containerunit. At least one cavity for receiving the object may be arranged atthe first container unit. By way of example, a plurality of cavities forreceiving an object each may be arranged at the first container unit. Insome embodiments, a first cavity for receiving a first object and asecond cavity for receiving a second object may be arranged at the firstcontainer unit.

Further, in some embodiments of the system described herein, the objectreceiving container may comprise at least one second container unit,which may be embodied to be movable relative to the first containerunit. Expressed differently, the first container unit and/or the secondcontainer unit may have such a movable embodiment that the secondcontainer unit adopts different positions relative to the firstcontainer unit. The second container unit may be able to be brought intoa first position and/or into a second position relative to the firstcontainer unit. In the second position of the second container unit, thesecond container unit may cover the cavity arranged at the firstcontainer unit or the cavities arranged at the first container unit.Expressed differently, the cavity arranged at the first container unit,and hence the object arranged in the cavity, may not be accessible onaccount of the cavity being covered by the second container unitsituated in the second position. By contrast, if the second containerunit is situated in the first position relative to the first containerunit, the cavity and the object arranged therein may be accessible. If aplurality of cavities are arranged at the first container unit, then thecavities arranged at the first container unit, and hence the objectsarranged in the cavities, may not be accessible on account of thecavities being covered by the second container unit situated in thesecond position. By contrast, if the second container unit is situatedin the first position relative to the first container unit, the cavitiesand the objects arranged therein may be accessible.

Further, in some embodiments of the system described herein, the objectreceiving container may comprise at least one fastening device which isarranged at the first container unit or at the second container unit,for the purposes of arranging the object receiving container at aholding device. The holding device may be an adapter device, forexample, which is arrangeable at a receiving device of a beam apparatusand/or an apparatus for processing an object and/or a mounting device.Expressed differently, the holding device may be an adapter device, forexample, which can be arranged at a receiving device of the beamapparatus and/or the apparatus for processing an object and/or themounting device.

In some embodiments of the system described herein, the object receivingcontainer allows safe and simple transportation between two examinationapparatuses. In particular, the object receiving container may beconfigured to ensure protection against contamination of the objectarranged in the cavity on account of the relative movement of the secondcontainer unit with respect to the first container unit into the secondposition and on account of the cover obtained therewith. Moreover, theobject receiving container may be configured to ensure that the objectcan be stored safely over a relatively long period of time, for examplemultiple days or months. Since the object may not need be removed fromthe object receiving container during storage, for example in anitrogen-cooled storage container, the orientation of the object in theobject receiving container may not change. This orientation may simplifya subsequent examination of the object by means of an examinationapparatus since the object receiving container may be insertable intothe examination apparatus after removing the object receiving containerfrom the storage container, with the orientation of the object alreadyknown. Information about the alignment and orientation of the object maybe arranged at the object receiving container by means of a marking.Further, in some embodiments, the object receiving container may ensurethat the latter can be arranged in as many different examinationapparatuses as possible. By way of example, the object receivingcontainer according to the invention may be arrangeable at a holdingdevice in the form of an adapter device. The adapter device may beconfigured in such a way that the object receiving container may bearranged at a receiving device of a respective beam apparatus and/or anapparatus for processing an object and/or a mounting device by means ofthe adapter device. In contrast to the prior art, the system describedherein may make it possible for the object to not have to be arranged atrespective different object holders, which have a physical configurationspecified for a respective apparatus, for the purposes of examiningand/or processing an object in different apparatuses. Rather, the systemdescribed herein may provide for the object to be arranged only once atthe object receiving container, which is then receivable in the variousexamination apparatuses.

The aforementioned holding device may have any suitable configuration.By way of example, the holding device may have an angled surface, atwhich the object receiving container may be arranged. As a result, itmay no longer be mandatory for the holding device, and hence also theobject receiving container, to be rotated about an axis of rotation, forexample in a sample chamber of a particle beam apparatus. Moreover, theholding device may comprise at least one receptacle for receivingactuation devices, in particular manipulators, by means of which theholding device may be moved.

In one embodiment of the object receiving container according to thesystem described herein, the second container unit may be arranged at adisplacing device in such a way that the second container unit is ableto be displaced into the first position and/or into the second positionrelative to the first container unit. Expressed differently, the firstcontainer unit and/or the second container unit may be displaceable suchthat the second container unit may be arranged in the first positionand/or in the second position relative to the first container unit. Thesecond container unit may cover the cavity arranged at the firstcontainer unit when the second container unit is in the second positionrelative to the first container unit. If a plurality of cavities arearranged at the first container unit, the second container unit maycover the cavities arranged at the first container unit. By contrast, ifthe second container unit is situated in the first position relative tothe first container unit, the cavity and the object arranged therein maybe accessible. If a plurality of cavities are arranged at the firstcontainer unit, then the cavities and the objects arranged therein maybe accessible. In a further embodiment, the second container unit may beembodied as a displacing device.

In a further embodiment of the object receiving container according tothe system described herein, the object receiving container may compriseat least one hinge device which is arranged both at the first containerunit and at the second container unit in such a way that the secondcontainer unit is able to be brought into the first position and/or intothe second position relative to the first container unit. Expresseddifferently, the first container unit and/or the second container unitmay be embodied to be movable in such a way on account of the hingedevice that the second container unit may be arranged in the firstposition and/or in the second position relative to the first containerunit. The second container unit may cover the cavity arranged at thefirst container unit when the second container unit is in the secondposition relative to the first container unit. If a plurality ofcavities are arranged at the first container unit, the second containerunit may cover the cavities arranged at the first container unit. Bycontrast, if the second container unit is situated in the first positionrelative to the first container unit, the cavity and the object arrangedtherein may be accessible. If a plurality of cavities are arranged atthe first container unit, then the cavities and the objects arrangedtherein may be accessible.

In one embodiment of the object receiving container according to thesystem described herein, the second container unit may be rotatable intothe first position and/or into the second position relative to the firstcontainer unit. By way of example, the second container unit may berotatable about a surface normal of the first container unit and/or thesecond container unit into the first position and/or into the secondposition relative to the first container unit.

In a further embodiment of the object receiving container according tothe system described herein, the second container unit may have at leastone through hole. By way of example, the second container unit may beembodied as a perforated panel, i.e., as a panel with at least onethrough hole. In the first position of the second container unitrelative to the first container unit, the through hole may be arrangedat the cavity such that the cavity and the object arranged therein areaccessible. If a plurality of cavities are arranged in the firstcontainer unit, then the cavities and the objects arranged therein maybe accessible, the through hole being arranged at the cavities or eachcavity of the plurality of cavities having a respective through holearranged thereagainst.

In an even further embodiment of the object receiving containeraccording to the system described herein, the second container unit maybe embodied as a leaf shutter. The leaf shutter may comprise movablyembodied blades, which may be movable into the first position and/orinto the second position.

In yet a further embodiment of the object receiving container accordingto the system described herein, the fastening device may comprise atleast one spring device. By way of example, the fastening device may beembodied as a spring device. For example, the fastening device maycomprise at least one snap ring and/or to be embodied as a snap ring.The embodiment of the fastening device as a spring device may be simplein terms of design and therefore cost-effective in terms of production.

In an even further embodiment of the object receiving containeraccording to the system described herein, the fastening device maycomprise a clamping device or to be embodied as a clamping device. Forexample, the fastening device may have a first clamping part and asecond clamping part. In addition or as an alternative thereto, thefastening device may comprise a screw and/or an eccentric disk, whereinthe screw and/or the eccentric disk may be used to clamp the objectreceiving container at a holding device. The embodiment of the fasteningdevice as a clamping device likewise may be simple in terms of designand therefore cost-effective in terms of production.

In one embodiment of the object receiving container according to thesystem described herein, the fastening device may have at least onefirst spring end and at least one second spring end. The first springend and the second spring end may be arranged at a distance from oneanother. Further, the first spring end may be embodied so as to bemovable relative to the second spring end. Expressed differently, thefirst spring end and/or the second spring end may have a movableembodiment. This may ensure that the object receiving containeraccording to the invention may be held in clamping fashion at theholding device and is easily detachable from the holding device again.

In a further embodiment of the object receiving container according tothe system described herein, the first spring end may have a firstengagement opening for the engagement of an actuation tool and thesecond spring end may have a second engagement opening for theengagement of the actuation tool. This arrangement may ensure a simpleoperation of the fastening device in the form of the spring device, sothat the object receiving container according to the system describedherein is able to be easily mounted on the holding device and is easilydetachable from the holding device again.

In yet a further embodiment of the object receiving container accordingto the system described herein, the first container unit may have afirst surface, wherein the first surface is arranged in a first plane.Further, the second container unit may have a second surface, whereinthe second surface is arranged in a second plane. Moreover, the firstsurface of the first container unit may rest against the second surfaceof the second container unit in the second position of the secondcontainer unit relative to the first container unit such that the cavityarranged at the first container unit is covered by the second surface ofthe second container unit. If a plurality of cavities are arranged atthe first container unit, then these cavities may be covered by thesecond surface of the second container unit. By contrast, in the firstposition of the second container unit relative to the first containerunit, the first surface of the first container unit may be arranged withrespect to the second surface of the second container unit in such a waythat the first plane is aligned with respect to the second plane asfollows: (i) the first plane is aligned parallel to the second plane or(ii) the first plane is identical to the second plane or (iii) the firstplane is aligned at an angle of more than 5° with respect to the secondplane.

In an even further embodiment of the object receiving containeraccording to the system described herein, the cavity may have at leastone first cavity opening and at least one second cavity opening. If aplurality of cavities are arranged at the first container unit, at leastone of the cavities may have a first cavity opening and a second cavityopening. In one embodiment, a plurality of cavities each may have afirst cavity opening and a second cavity opening. The second containerunit may cover the first cavity opening or the first cavity openingswhen the second container unit is in the second position relative to thefirst container unit. Moreover, a covering device for covering thesecond cavity opening or the second cavity openings may be arranged atthe second cavity opening or at the second cavity openings. The openingsof the cavity may be covered by different units in this embodiment. Thefirst cavity opening may be covered by the second container unit. Bycontrast, the second cavity opening may be covered by the coveringdevice. If a plurality of first cavity openings and a plurality ofsecond cavity openings are present, the plurality of first cavityopenings may be covered by the second container unit. By contrast, theplurality of second cavity openings may be covered by the coveringdevice. In a further embodiment, the plurality of second cavity openingseach may have a covering device, said covering devices being used tocover the respective second cavity openings.

In one embodiment of the object receiving container according to thesystem described herein, the first cavity opening and the second cavityopening may be arranged opposite one another. For example, the coveringdevice may be embodied as a sliding device. Expressed differently, thecovering device may be displaceable relative to the second cavityopening such that the covering device is able to be brought into acovering position and into an exposing position. The second cavityopening may be covered by the covering device in the covering position.In the exposing position, the object may be accessible through thesecond cavity opening. If a plurality of cavities, which each have afirst cavity opening and each have a second cavity opening, are arrangedat the first container unit, then provision may be made in thisembodiment for the covering device to be displaceable relative to thesecond cavity openings in such a way that the covering device is able tobe brought into a covering position and into an exposing position. Thesecond cavity openings may be covered by the covering device in thecovering position. The objects arranged in the cavities may beaccessible through the second cavity openings in the exposing position.If a respective covering device is arranged at a respective secondcavity opening, then provision may be made in this embodiment for therespective covering device to be displaceable relative to the respectivesecond cavity opening in such a way that the respective covering devicemay be able to be brought into a covering position and into an exposingposition. The respective second cavity opening may be covered by therespective covering device in the covering position. In the exposingposition, the object arranged in the respective cavity may be accessiblethrough the respective second cavity opening. The aforementionedembodiments may be advantageous if examinations of the object arecarried out, within the scope of which particles of a particle beam maybe transmitted through the object and/or interaction particles whicharise on account of an interaction of a particle beam with the objectmay emerge from the object at a side of the object arranged at thesecond cavity opening. The transmitted particles and/or the interactionparticles may then be detected by a detector.

The system described herein also may relate to an object holding systemcomprising at least one object receiving container, having at least oneof the features specified further above or yet to be specified below ora combination of at least two of the features specified further above oryet to be specified below. Moreover, the object holding system accordingto the system described herein may be provided with at least one holdingdevice which may comprise a receptacle. The fastening device of theobject receiving container may be arrangeable at the receptacle. Theholding device is, for example, an adapter device, which is arrangeableat a receiving device of a beam apparatus and/or an apparatus forprocessing an object and/or a mounting device. The adapter device may beconfigured in such a way that the object receiving container may bearranged at the receiving device of the respective beam apparatus and/orthe respective apparatus for processing an object and/or the respectivemounting device by means of the adapter device. In contrast to the priorart, the invention therefore renders it possible that an object to beexamined need not be arranged multiple times at different objectholders; instead, said object may be arranged a single time at theobject receiving container according to the invention, which then may bereceivable in different examination apparatuses.

The aforementioned holding device of the object holding system accordingto the system described herein may have any suitable configuration. Byway of example, the holding device may have an angled surface, at whichthe object receiving container is arranged. As a result, it may nolonger be mandatory for the holding device, and hence also the objectreceiving container, to be rotated about an axis of rotation, forexample in a sample chamber of a particle beam apparatus. Moreover, theholding device may comprise receptacles for receiving actuation devices,in particular manipulators, by means of which the holding device may bemoved.

The system described herein also may relate to a beam apparatus forimaging, analyzing and/or processing an object. The beam apparatusaccording to the system described herein may comprise at least one beamgenerator for generating a beam, at least one objective lens forfocusing the beam onto the object, at least one display device fordisplaying an image and/or an analysis of the object and at least onecooling device for cooling the object to cryo-temperatures. By way ofexample, liquid nitrogen or liquid helium is arranged in the coolingdevice. Moreover, the beam apparatus according to the invention isprovided with an object receiving container, having at least one of thefeatures specified further above or yet to be specified below or acombination of at least two of the features specified further above oryet to be specified below. As an alternative thereto, the beam apparatusmay comprise at least one object holding system having at least one ofthe features specified further above or yet to be specified below or acombination of at least two of the features specified further above oryet to be specified below.

In one embodiment of the beam apparatus according to the systemdescribed herein, the beam apparatus is embodied as a particle beamapparatus. Then, the beam generator may be embodied as a beam generatorfor generating a particle beam with charged particles. The chargedparticles may be electrons or ions, for example. The objective lens ofthe particle beam apparatus according to the invention may serve tofocus the particle beam onto the object. Moreover, the particle beamapparatus according to the system described herein may comprise at leastone scanning device for scanning the particle beam over the object.Further, the particle beam apparatus according to the system describedherein may comprise at least one detector for detecting interactionparticles and/or interaction radiation which may emerge from aninteraction between the particle beam and the object when the particlebeam is incident on the object.

In one embodiment of the particle beam apparatus according to the systemdescribed herein, the beam generator is embodied as a first beamgenerator and the particle beam is embodied as a first particle beamcomprising first charged particles. Further, the objective lens may beembodied as a first objective lens for focusing the first particle beamonto the object. Moreover, the particle beam apparatus according to thesystem described herein may comprise at least one second beam generatorfor generating a second particle beam comprising second chargedparticles. Further, the particle beam apparatus according to the systemdescribed herein may comprise at least one second objective lens forfocusing the second particle beam onto the object.

In particular, the beam apparatus may be embodied as an electron beamapparatus and/or as an ion beam apparatus.

In an even further embodiment of the beam apparatus according to thesystem described herein, the beam apparatus may be a light beamapparatus. Consequently, the beam generator may be embodied to generatelight beams.

The system described herein also may relate to an apparatus forprocessing an object, comprising at least one processing device forprocessing the object and at least one cooling device for cooling theobject to cryo-temperatures. Moreover, the apparatus according to thesystem described herein may be provided with an object receivingcontainer arranged at the cooling device and having at least one of thefeatures specified further above or yet to be specified below or acombination of at least two of the features specified further above oryet to be specified below. As an alternative thereto, the apparatus maycomprise at least one object holding system arranged at the coolingdevice and having at least one of the features specified further aboveor yet to be specified below or a combination of at least two of thefeatures specified further above or yet to be specified below. By way ofexample, the processing device is embodied as a mechanical cuttingdevice and/or as a laser cutting device and/or as a device for electronbeam-induced deposition of layers on the object, for example using agas, and/or as a device for ion beam-induced deposition of layers on theobject, for example using a gas, and/or as a sputtering apparatus.

The system described herein also may relate to a method for examining,analyzing and/or processing an object at cryo-temperatures, having anyone of the following steps: (i) using an object receiving containerhaving one of the features specified further above or yet to bespecified below or a combination of at least two of the featuresspecified further above or yet to be specified below; (ii) using anobject holding system having one of the features specified further aboveor yet to be specified below or a combination of at least two of thefeatures specified further above or yet to be specified below; (iii)using a beam apparatus having one of the features specified furtherabove or yet to be specified below or a combination of at least two ofthe features specified further above or yet to be specified below; or(iv) using an apparatus for processing an object having one of thefeatures specified further above or yet to be specified below or acombination of at least two of the features specified further above oryet to be specified below.

In one embodiment of the method according to the system describedherein, the method may include the following steps:

-   -   moving the second container unit relative to the first container        unit in such a way that the second container unit adopts the        first position relative to the first container unit and that the        cavity arranged at the first container unit or the cavities        arranged at the first container unit is/are accessible.        Expressed differently, the first container unit and/or the        second container unit may be moved in such a way that the second        container unit adopts the first position relative to the first        container unit such that the cavity arranged at the first        container unit or the cavities arranged at the first container        unit is/are accessible. By way of example, the first container        unit and/or the second container unit may be moved by means of a        tool. In addition or as an alternative thereto, the object        receiving container may be moved in such a way that the first        container unit and/or the second container unit move/moves on        account of gravity such that the second container unit is        brought into the first position relative to the first container        unit;    -   arranging the object in the cavity or arranging a respective        object in a respective cavity of the plurality of cavities. By        way of example, an object may be arranged in a cavity of the        first container unit with the aid of a mounting device. By way        of example, the mounting device has an interior, which may be        surrounded by an insulated wall. By way of example, a holder for        the object receiving container may be arranged in the interior.        By filling the interior, for example with liquid nitrogen or        liquid helium, the holding device and the object receiving        container may be cooled to cryo-temperatures such that the        object may be arranged in the cavity under cryo-temperatures;    -   moving the second container unit relative to the first container        unit in such a way that the second container unit adopts the        second position and that the cavity arranged in the first        container unit or the cavities arranged in the first container        unit is/are covered by the second container unit. Expressed        differently, the first container unit and/or the second        container unit may be moved in such a way that the second        container unit adopts the second position relative to the first        container unit such that the cavity arranged at the first        container unit or the cavities arranged at the first container        unit is/are covered by the second container unit. By way of        example, the first container unit and/or the second container        unit may be moved by means of a tool. In addition or as an        alternative thereto, the object receiving container may be moved        in such a way that the first container unit and/or the second        container unit move/moves on account of gravity such that the        second container unit is brought into the second position        relative to the first container unit;    -   arranging the object receiving container at the holding device        of the object holding system by arranging the fastening device        of the object receiving container at the receptacle of the        holding device in such a way that the fastening device is held        at the receptacle. By way of example, a spring device may be        used as fastening device.

In particular, the fastening device may comprise at least one snap ringand/or may be embodied as a snap ring. Further the spring device mayhave a first spring end and a second spring end. The first spring endand the second spring end may be arranged at a distance from oneanother. Further, the first spring end may be embodied so as to bemovable relative to the second spring end. By way of example, the firstspring end has a first engagement opening for the engagement of anactuation tool and the second spring end has a second engagement openingfor the engagement of the actuation tool. This arrangement may ensure asimple operation of the spring device such that the object receivingcontainer according to the system described herein is able to be easilyassembled at the holding device, is held at the holding device inclamping fashion and maybe easily released from the holding deviceagain. In addition or as an alternative thereto, the fastening devicemay comprise a clamping device or be embodied as a clamping device suchthat the object receiving container is held at the holding device of theobject holding system in clamping fashion. In particular, to this end,the fastening device may have a first clamping part and a secondclamping part. In addition or as an alternative thereto, the fasteningdevice may comprise a screw and/or an eccentric disk, wherein the screwand/or the eccentric disk may be used to clamp the object receivingcontainer at the holding device;

-   -   introducing the holding device of the object holding system into        the beam apparatus or the apparatus for processing the object;    -   arranging the holding device at the cooling device of the beam        apparatus or of the apparatus for processing the object;    -   moving the second container unit relative to the first container        unit in such a way that the second container unit adopts the        first position and that the object arranged in the cavity or the        objects arranged in the cavities is/are accessible. Expressed        differently, the first container unit and/or the second        container unit may be moved in such a way that the second        container unit adopts the first position relative to the first        container unit such that the cavity arranged at the first        container unit or the cavities arranged at the first container        unit is/are accessible. By way of example, the first container        unit and/or the second container unit may be moved by means of a        tool. In addition or as an alternative thereto, the object        receiving container may be moved in such a way that the first        container unit and/or the second container unit move/moves on        account of gravity such that the second container unit is        brought into the first position relative to the first container        unit; and    -   examining, analyzing and/or processing the object using the beam        apparatus or the apparatus for processing the object.

In an even further embodiment of the method according to the systemdescribed herein, the method may include the following steps:

-   -   arranging the holding device at a transportation device. By way        of example, the transportation device may be a device which is        movable by means of a manipulator and which may be movable from        a workstation arranged at the beam apparatus or the apparatus        for processing the object into a sample chamber of the beam        apparatus or of the apparatus for processing the object. By way        of example, such a transportation device may be referred to as a        “shuttle”;    -   introducing the transportation device into the beam apparatus or        the apparatus for processing the object; and    -   arranging the transportation device at the cooling device.

In yet a further embodiment of the method according to the systemdescribed herein, the method may include the following step: moving thecovering device in relative fashion for covering or exposing the secondcavity opening or second cavity openings.

Explicit reference is made to the fact that the temporal sequence ofindividual steps of the method according to the system described hereinis able to be chosen freely. Accordingly, the method according to thesystem described herein is not restricted to the aforementioned sequenceof the steps of the method according to the system described herein.

Embodiments of: the object receiving container according to the systemdescribed herein, the object holding system according to the systemdescribed herein, the beam apparatus according to the system describedherein and/or the apparatus for processing the object according to thesystem described herein and/or the method according to the systemdescribed herein may ensure that an object arranged in the objectreceiving container according to the system described herein is easilyexaminable, analyzable and/or processable under cryo-temperatures usingdifferent work processes. By way of example, the object receivingcontainer according to embodiments of the system described herein may beused to examine and/or analyze the object by means of x-rayspectroscopy, by means of near field scanning microscopy, by means ofatomic force microscopy, by means of a combination apparatus having anion beam apparatus and an electron beam apparatus, by means oftransmission electron microscopy, by means of Raman spectroscopy and/orby means of secondary ion mass spectrometry. In addition or as analternative thereto, the object receiving container according toembodiments of the system described herein may be used when polishingthe object, when cutting the object by means of a blade or a laserand/or when applying materials to the object. The aforementioned listsshould be understood to be illustrative. The object receiving containeraccording to embodiments of the system described herein may be used forany desired and suitable method.

By way of example, the beam apparatus according to embodiments of thesystem described herein, as explained further above or yet to beexplained below, or the apparatus according to embodiments of the systemdescribed herein for processing the object may comprise a processor.Loaded onto the processor may be a computer program product whichcontrols the beam apparatus or the apparatus for processing the objectin such a way that the method according to embodiments of the systemdescribed herein having one of the features specified further above oryet to be specified below or a combination of at least two of thefeatures specified further above or yet to be specified below is carriedout.

BRIEF DESCRIPTION OF THE DRAWINGS

The system described herein will be explained in more detail below onthe basis of embodiments using drawings. In detail:

FIG. 1 shows a first embodiment of a particle beam apparatus of thesystem described herein;

FIG. 2 shows a second embodiment of a particle beam apparatus of thesystem described herein;

FIG. 3 shows a third embodiment of a particle beam apparatus of thesystem described herein;

FIG. 4 shows a schematic illustration of a light microscope, accordingto an embodiment of the system described herein;

FIG. 4A shows a schematic illustration of an apparatus for processing anobject, according to an embodiment of the system described herein;

FIG. 5 shows a schematic illustration of an embodiment of an objectstage with a movable embodiment for a particle beam apparatus and/or alight microscope and/or an apparatus for processing the object,according to an embodiment of the system described herein;

FIG. 6 shows a further schematic illustration of the object stageaccording to FIG. 5, according to an embodiment of the system describedherein;

FIG. 7 shows a first schematic illustration of an object receivingcontainer, according to an embodiment of the system described herein;

FIG. 8 shows a second schematic illustration of the object receivingcontainer according to FIG. 7, according to an embodiment of the systemdescribed herein;

FIG. 9 shows a third schematic illustration of the object receivingcontainer according to FIG. 7, according to an embodiment of the systemdescribed herein;

FIG. 10 shows a fourth schematic illustration of the object receivingcontainer according to FIG. 7, according to an embodiment of the systemdescribed herein;

FIG. 11 shows a schematic illustration of a further object receivingcontainer, according to an embodiment of the system described herein;

FIG. 12 shows a first schematic illustration of a mounting device for anobject receiving container, according to an embodiment of the systemdescribed herein;

FIG. 13 shows a second schematic illustration of the mounting deviceaccording to FIG. 12, according to an embodiment of the system describedherein;

FIG. 14 shows a third schematic illustration of the mounting deviceaccording to FIG. 12 in a sectional view, according to an embodiment ofthe system described herein;

FIG. 15 shows a fifth schematic illustration of the object receivingcontainer according to FIG. 7, according to an embodiment of the systemdescribed herein;

FIG. 16 shows a schematic illustration of a first embodiment of aholding device for the object receiving container of the systemdescribed herein;

FIG. 17 shows a schematic illustration of a second embodiment of aholding device for the object receiving container of the systemdescribed herein;

FIG. 18 shows a further schematic illustration of the first embodimentof a holding device for the object receiving container of the systemdescribed herein according to FIG. 16;

FIG. 19 shows a schematic illustration of a third embodiment of aholding device for the object receiving container of the systemdescribed herein;

FIG. 20 shows a schematic illustration of a flowchart of a firstembodiment of the method according to the system described herein;

FIG. 21 shows a schematic illustration of a flowchart of a secondembodiment of the method according to the system described herein;

FIG. 22 shows a schematic illustration of a flowchart of a thirdembodiment of the method according to the system described herein;

FIG. 23 shows a schematic illustration of a flowchart of a fourthembodiment of the method according to the system described herein;

FIG. 24 shows a schematic illustration of a further mounting device foran object receiving container, according to an embodiment of the systemdescribed herein;

FIG. 24 shows a schematic illustration of a further mounting device foran object receiving container, according to an embodiment of the systemdescribed herein;

FIG. 25 shows a schematic illustration of a first partial view of thefurther mounting device according to FIG. 24, according to an embodimentof the system described herein;

FIG. 26 shows a schematic illustration of a second partial view of thefurther mounting device according to FIG. 24, according to an embodimentof the system described herein; and

FIG. 27 shows a schematic illustration of a third partial view of thefurther mounting device according to FIG. 24, according to an embodimentof the system described herein.

DESCRIPTION OF VARIOUS EMBODIMENTS

The system described herein is now explained in more detail by means ofparticle beam apparatuses in the form of an SEM and in the form of acombination apparatus, which has an electron beam column and an ion beamcolumn. Reference is explicitly made to the fact that the systemdescribed herein may be used in any particle beam apparatus, inparticular in any electron beam apparatus and/or any ion beam apparatus.Further, the system described herein will be explained in more detail onthe basis of a light microscope and an apparatus for processing anobject.

FIG. 1 shows a schematic illustration of an SEM 100. The SEM 100 maycomprise a first beam generator in the form of an electron source 101,which may be embodied as a cathode. Further, the SEM 100 may be providedwith an extraction electrode 102 and with an anode 103, which may beplaced onto one end of a beam guiding tube 104 of the SEM 100. By way ofexample, the electron source 101 may be embodied as a thermal fieldemitter. However, the system described herein is not restricted to suchan electron source 101. Rather, any electron source is utilizable.

Electrons emerging from the electron source 101 may form a primaryelectron beam. The electrons may be accelerated to the anode potentialon account of a potential difference between the electron source 101 andthe anode 103. In the embodiment illustrated here, the anode potentialmay be 100 V to 35 kV, e.g. 5 kV to 15 kV, in particular 8 kV, relativeto a ground potential of a housing of a sample chamber 120. However,alternatively it also may be at ground potential.

Two condenser lenses, specifically a first condenser lens 105 and asecond condenser lens 106, may be arranged at the beam guiding tube 104.Here, proceeding from the electron source 101 as viewed in the directionof a first objective lens 107, the first condenser lens 105 may bearranged first, followed by the second condenser lens 106. Reference isexplicitly made to the fact that further embodiments of the SEM 100 mayhave only a single condenser lens. A first aperture unit 108 may bearranged between the anode 103 and the first condenser lens 105.Together with the anode 103 and the beam guiding tube 104, the firstaperture unit 108 may be at a high voltage potential, specifically thepotential of the anode 103, or connected to ground. The first apertureunit 108 may have numerous first apertures 108A, of which one isillustrated in FIG. 1. By way of example, two first apertures 108A arepresent. Each one of the numerous first apertures 108A may have adifferent aperture diameter. By means of an adjustment mechanism (notillustrated), it may be possible to set a desired first aperture 108Aonto an optical axis OA of the SEM 100. Reference is explicitly made tothe fact that, in further embodiments, the first aperture unit 108 maybe provided with only a single first aperture 108A. In this embodiment,an adjustment mechanism may be absent. The first aperture unit 108 thenmay be designed to be stationary. A stationary second aperture unit 109may be arranged between the first condenser lens 105 and the secondcondenser lens 106. As an alternative thereto, the second aperture unit109 may be embodied in a movable fashion.

The first objective lens 107 may have pole pieces 110, in which a holemay be formed. The beam guiding tube 104 may be guided through thishole. A coil 111 may be arranged in the pole pieces 110.

An electrostatic retardation device may be arranged in a lower region ofthe beam guiding tube 104, and may comprise an individual electrode 112and a tube electrode 113. The tube electrode 113 may be arranged at oneend of the beam guiding tube 104, which faces an object receivingcontainer 125. The object receiving container 125 may be arranged at aholding device 114. An object may be arranged at the object receivingcontainer 125. This is explained in more detail below.

Together with the beam guiding tube 104, the tube electrode 113 may beat the potential of the anode 103, while the individual electrode 112and an object arranged at the object receiving container 125 may be at alower potential in relation to the potential of the anode 103. In thepresent case, this may be the ground potential of the housing of thesample chamber 120. In this way, the electrons of the primary electronbeam may be decelerated to a desired energy, which may be required forexamining the object.

The SEM 100 further may comprise a scanning device 115, by means ofwhich the primary electron beam may be deflected and scanned over theobject. Here, the electrons of the primary electron beam may interactwith the object. As a result of the interaction, interaction particlesarise, which may be detected. In particular, electrons may be emittedfrom the surface of the object—so-called secondary electrons—orelectrons of the primary electron beam may be backscattered—so-calledbackscattered electrons—as interaction particles.

The object and the individual electrode 112 may also be at differentpotentials and potentials different than ground. It is thereby possibleto set the location of the retardation of the primary electron beam inrelation to the object. If, by way of example, the retardation iscarried out quite close to the object, imaging aberrations becomesmaller.

A detector arrangement comprising a first detector 116 and a seconddetector 117 may be arranged in the beam guiding tube 104 for detectingthe secondary electrons and/or the backscattered electrons. Here, thefirst detector 116 may be arranged on the source side along the opticalaxis OA, while the second detector 117 may be arranged on the objectside along the optical axis OA in the beam guiding tube 104. The firstdetector 116 and the second detector 117 may be arranged offset from oneanother in the direction of the optical axis OA of the SEM 100. Both thefirst detector 116 and the second detector 117 each may have a passageopening, through which the primary electron beam may pass. The firstdetector 116 and the second detector 117 may be approximately at thepotential of the anode 103 and of the beam guiding tube 104. The opticalaxis OA of the SEM 100 extends through the respective passage openings.

The second detector 117 may serve principally for detecting secondaryelectrons. Upon emerging from the object, the secondary electronsinitially have a low kinetic energy and arbitrary directions of motion.By means of the strong extraction field emanating from the tubeelectrode 113, the secondary electrons may be accelerated in thedirection of the first objective lens 107. The secondary electrons enterthe first objective lens 107 approximately parallel. The beam diameterof the beam of the secondary electrons may remain small in the firstobjective lens 107 as well. The first objective lens 107 then may have astrong effect on the secondary electrons and may generate acomparatively short focus of the secondary electrons with sufficientlysteep angles with respect to the optical axis OA, such that thesecondary electrons diverge far apart from one another downstream of thefocus and strike the second detector 117 on the active area thereof. Bycontrast, only a small proportion of electrons that may be backscatteredat the object—that is to say backscattered electrons which have arelatively high kinetic energy in comparison with the secondaryelectrons upon emerging from the object—may be detected by the seconddetector 117. The high kinetic energy and the angles of thebackscattered electrons with re-spect to the optical axis OA uponemerging from the object may have the effect that a beam waist, that isto say a beam region having a minimum diameter, of the backscatteredelectrons lies in the vicinity of the second detector 117. A largeportion of the backscattered electrons may pass through the passageopening of the second detector 117. Therefore, the first detector 116substantially may serve to detect the backscattered electrons.

In a further embodiment of the SEM 100, the first detector 116 mayadditionally be embodied with an opposing field grid 116A. The opposingfield grid 116A may be arranged at the side of the first detector 116directed toward the object. With respect to the potential of the beamguiding tube 104, the opposing field grid 116A may have a negativepotential such that only backscattered electrons with a high energy passthrough the opposing field grid 116A to the first detector 116. Inaddition or as an alternative thereto, the second detector 117 may havea further opposing field grid, which may have an analogous embodiment tothe aforementioned opposing field grid 116A of the first detector 116and which may have an analogous function.

Further, the SEM 100 may have in the sample chamber 120 a chamberdetector 119, for example an Everhart-Thornley detector or an iondetector, which may have a detection surface that is coated with metaland blocks light.

The detection signals generated by the first detector 116, the seconddetector 117 and the chamber detector 119 may be used to generate animage or images of the surface of the object.

Reference is explicitly made to the fact that the apertures of the firstaperture unit 108 and of the second aperture unit 109, as well as thepassage openings of the first detector 116 and of the second detector117, are illustrated in exaggerated fashion. The passage openings of thefirst detector 116 and of the second detector 117 may have an extentperpendicular to the optical axis OA in the range of 0.5 mm to 5 mm. Byway of example, they are of circular design and may have a diameter inthe range of 1 mm to 3 mm perpendicular to the optical axis OA.

The second aperture unit 109 may be configured as a pinhole unit in theembodiment illustrated here and is provided with a second aperture 118for the passage of the primary electron beam, which may have an extentin the range from 5 μm to 500 μm, e.g., 35 μm. As an alternativethereto, the second aperture unit 109 may be provided with a pluralityof apertures, which may be displaced mechanically with respect to theprimary electron beam or which may be reached by the primary electronbeam by the use of electrical and/or magnetic deflection elements. Thesecond aperture unit 109 may be embodied as a pressure stage unit. Thisseparates a first region, in which the electron source 101 may bearranged and in which an ultra-high vacuum (10⁻⁷ hPa to 10⁻¹² hPa)prevails, from a second region, which may have a high vacuum (10⁻³ hPato 10⁻⁷ hPa). The second region may be the intermediate pressure regionof the beam guiding tube 104, which leads to the sample chamber 120.

The sample chamber 120 may be under vacuum. For the purposes ofproducing the vacuum, a pump (not illustrated) is arranged at the samplechamber 120. In the embodiment illustrated in FIG. 1, the sample chamber120 may be operated in a first pressure range or in a second pressurerange. The first pressure range may comprise only pressures of less thanor equal to 10⁻³ hPa, and the second pressure range may comprise onlypressures of greater than 10⁻³ hPa. To ensure said pressure ranges, thesample chamber 120 may be vacuum-sealed.

The holding device 114 may be arranged at an object stage 122. Theobject stage 122 may be embodied to be movable in three directionsarranged perpendicular to one another, specifically in an x-direction(first stage axis), in a y-direction (second stage axis), and in az-direction (third stage axis). Moreover, the object stage 122 may berotated about two rotation axes which may be arranged perpendicular toone another (stage rotation axes). The system described herein is notrestricted to the object stage 122 described above. Rather, the objectstage 122 may have further translation axes and rotation axes alongwhich or about which the object stage 122 may move.

In a further embodiment of the SEM 100, the holding device 114 may beembodied as an object receiving device, for example in the form of amanipulator and/or a gripper for holding the object receiving container125. Then, the holding device 114 may have a movable embodiment, forexample as explained above and further below in respect of the objectstage 122.

The SEM 100 further may comprise a third detector 121, which may bearranged in the sample chamber 120. More precisely, the third detector121 may be arranged downstream of the holding device 114 when viewedfrom the electron source 101 along the optical axis OA. The holdingdevice 114 may be rotated in such a way that the object arranged in theobject receiving container 125 may have the primary electron beamradiated therethrough. When the primary electron beam passes through theobject to be examined, the electrons of the primary electron beam mayinteract with the material of the object to be examined. The electronspassing through the object to be examined may be detected by the thirddetector 121.

Arranged at the sample chamber 120 may be a radiation detector 500,which may be used to detect interaction radiation, for example x-rayradiation and/or cathodoluminescence light. The radiation detector 500,the first detector 116, the second detector 117, and the chamberdetector 119 may be connected to a control unit 123, which may comprisea monitor 124. The third detector 121 also may be connected to thecontrol unit 123. This is not illustrated for reasons of clarity. Thecontrol unit 123 may process detection signals that are generated by thefirst detector 116, the second detector 117, the chamber detector 119,the third detector 121 and/or the radiation detector 500 and displayssaid detection signals in the form of images on the monitor 124.

The control unit 123 may comprise a database 126, in which the controlunit 123 may store data and/or from which data may be loaded onto aprocessor of the control unit 123.

Arranged at the holding device 114 may be a cooling and/or heatingdevice 127, which may be used for cooling and/or heating the holdingdevice 114 and/or the object receiving container 125 and hence theobject arranged therein. This is discussed in more detail further below.

To determine a temperature of the object, a temperature of the holdingdevice 114, a temperature of the object receiving container 125 and/or atemperature of the object stage 122, a temperature measuring unit 128may be arranged in the sample chamber 120. By way of example, thetemperature measuring unit 128 may be embodied as an infrared measuringapparatus or as a semiconductor temperature sensor. However, the systemdescribed herein is not restricted to the use of such temperaturemeasuring units. Rather, any temperature measuring unit which issuitable for the system described herein may be used as temperaturemeasuring unit.

The control unit 123 of the SEM 100 may comprise the processor or may beembodied as a processor. A computer program product that controls theSEM 100 in such a way that the method according to embodiments of thesystem described herein is carried out may be loaded onto the processor.This is discussed in more detail further below.

FIG. 2 shows a particle beam apparatus in the form of a combinationapparatus 200. The combination apparatus 200 may have two particle beamcolumns. Firstly, the combination apparatus 200 may be provided with theSEM 100, as already illustrated in FIG. 1, but without the samplechamber 120. Rather, the SEM 100 may be arranged at a sample chamber201. The sample chamber 201 may be under vacuum. For the purposes ofproducing the vacuum, a pump (not illustrated) may be arranged at thesample chamber 201. In the embodiment illustrated in FIG. 2, the samplechamber 201 may be operated in a first pressure range or in a secondpressure range. The first pressure range may comprise only pressures ofless than or equal to 10⁻³ hPa, and the second pressure range maycomprise only pressures of greater than 10⁻³ hPa. To ensure saidpressure ranges, the sample chamber 201 may be vacuum-sealed.

Arranged in the sample chamber 201 may be a chamber detector 119 whichis embodied, for example, in the form of an Everhart-Thornley detectoror an ion detector and which may have a detection surface that is coatedwith metal and blocks light. Further, the third detector 121 may bearranged in the sample chamber 201.

The SEM 100 may serve to generate a first particle beam, specificallythe primary electron beam already described further above, and has theoptical axis, already specified above, which is provided with thereference sign 709 in FIG. 2 and which also may be referred to as firstbeam axis below. Secondly, the combination apparatus 200 may be providedwith an ion beam apparatus 300, which likewise may be arranged at thesample chamber 201. The ion beam apparatus 300 likewise has an opticalaxis, which is provided with the reference sign 710 in FIG. 2 and whichalso may be referred to as second beam axis below.

The SEM 100 may be arranged vertically in relation to the sample chamber201. By contrast, the ion beam apparatus 300 may be arranged in a mannerinclined by an angle of approximately 0° to 90° in relation to the SEM100. An arrangement of approximately 50° is illustrated by way ofexample in FIG. 2. The ion beam apparatus 300 may comprise a second beamgenerator in the form of an ion beam generator 301. Ions, which form asecond particle beam in the form of an ion beam, may be generated by theion beam generator 301. The ions may be accelerated by means of anextraction electrode 302, which may be at a predeterminable potential.The second particle beam then may pass through an ion optical unit ofthe ion beam apparatus 300, wherein the ion optical unit may comprise acondenser lens 303 and a second objective lens 304. The second objectivelens 304 ultimately may generate an ion probe, which may be focused ontoan object which may be arranged at an object receiving container 125.The object receiving container 125 may be arranged at a holding device114. The holding device 114 may be arranged in turn at an object stage122.

In a further embodiment of the combination apparatus 200, the holdingdevice 114 may be embodied as an object receiving device, for example inthe form of a manipulator and/or a gripper for holding the objectreceiving container 125. Then, the holding device 114 may have a movableembodiment, for example as explained above and further below in respectof the object stage 122.

An adjustable or selectable aperture unit 306, a first electrodearrangement 307 and a second electrode arrangement 308 may be arrangedabove the second objective lens 304 (i.e., in the direction of the ionbeam generator 301), wherein the first electrode arrangement 307 and thesecond electrode arrangement 308 may be embodied as scanning electrodes.The second particle beam may be scanned over the surface of the objectby means of the first electrode arrangement 307 and the second electrodearrangement 308, with the first electrode arrangement 307 acting in afirst direction and the second electrode arrangement 308 acting in asecond direction, which may be counter to the first direction. Thus,scanning may be carried out in an x-direction, for example. The scanningin a y-direction perpendicular thereto may be brought about by furtherelectrodes (not illustrated), which may be rotated by 90°, at the firstelectrode arrangement 307 and at the second electrode arrangement 308.

As explained above, the holding device 114 may be arranged at the objectstage 122. In the embodiment shown in FIG. 2, too, the object stage 122may be embodied to be movable in three directions arranged perpendicularto one another, specifically in an x-direction (first stage axis), in ay-direction (second stage axis) and in a z-direction (third stage axis).Moreover, the object stage 122 may be rotated about two rotation axeswhich may be arranged perpendicular to one another (stage rotationaxes).

The distances illustrated in FIG. 2 between the individual units of thecombination apparatus 200 are illustrated in exaggerated fashion inorder to better illustrate the individual units of the combinationapparatus 200.

Arranged at the sample chamber 201 may be a radiation detector 500,which may be used to detect interaction radiation, for example x-rayradiation and/or cathodoluminescence light. The radiation detector 500may be connected to a control unit 123, which may have a monitor 124.The control unit 123 may process detection signals that may be generatedby the first detector 116, the second detector 117 (not illustrated inFIG. 2), the chamber detector 119, the third detector 121 and/or theradiation detector 500 and displays said detection signals in the formof images on the monitor 124.

The control unit 123 may comprise a database 126, in which the controlunit 123 may store data and/or from which data may be loaded onto aprocessor of the control unit 123.

Arranged at the holding device 114 may be a cooling and/or heatingdevice 127, which may be used for cooling and/or heating the holdingdevice 114, the object receiving container 125 and/or the object. Thisis discussed in more detail further below.

To determine a temperature of the object, a temperature of the holdingdevice 114, a temperature of the object receiving container 125 and/or atemperature of the object stage 122, a temperature measuring unit 128may be arranged in the sample chamber 201. By way of example, thetemperature measuring unit 128 may be embodied as an infrared measuringapparatus or as a semiconductor temperature sensor. However, the systemdescribed herein is not restricted to the use of such temperaturemeasuring units. Rather, any temperature measuring unit which issuitable for the system described herein may be used as temperaturemeasuring unit.

The control unit 123 of the combination apparatus 200 may comprise theprocessor or may be embodied as a processor. A computer program productthat controls the combination apparatus 200 in such a way that themethod according to embodiments of the system described herein iscarried out may be loaded onto the processor. This is discussed in moredetail further below.

FIG. 3 is a schematic illustration of a further embodiment of a particlebeam apparatus according to embodiments of the system described herein.This embodiment of the particle beam apparatus may be provided with thereference sign 400 and may comprise a mirror corrector for correctinge.g. chromatic and/or spherical aberrations. The particle beam apparatus400 may comprise a particle beam column 401, which may be embodied as anelectron beam column and which substantially corresponds to an electronbeam column of a corrected SEM. However, the particle beam apparatus 400is not restricted to an SEM with a mirror corrector. Rather, theparticle beam apparatus may comprise any type of corrector units.

The particle beam column 401 may comprise a particle beam generator inthe form of an electron source 402 (cathode), an extraction electrode403, and an anode 404. By way of example, the electron source 402 isembodied as a thermal field emitter. Electrons emerging from theelectron source 402 may be accelerated to the anode 404 on account of apotential difference between the electron source 402 and the anode 404.Accordingly, a particle beam in the form of an electron beam may beformed along a first optical axis OA1.

The particle beam may be guided along a beam path, which corresponds tothe first optical axis OA1, after the particle beam has emerged from theelectron source 402. A first electrostatic lens 405, a secondelectrostatic lens 406, and a third electrostatic lens 407 may be usedto guide the particle beam.

Furthermore, the particle beam may be set along the beam path using abeam guiding device. The beam guiding device of this embodiment maycomprise a source setting unit with two magnetic deflection units 408arranged along the first optical axis OA1. Moreover, the particle beamapparatus 400 may comprise electrostatic beam deflection units. A firstelectrostatic beam deflection unit 409, which also may be embodied as aquadrupole in a further embodiment, may be arranged between the secondelectrostatic lens 406 and the third electrostatic lens 407. The firstelectrostatic beam deflection unit 409 likewise may be arrangeddownstream of the magnetic deflection units 408. A first multi-pole unit409A in the form of a first magnetic deflection unit may be arranged atone side of the first electrostatic beam deflection unit 409. Moreover,a second multi-pole unit 409B in the form of a second magneticdeflection unit may be arranged at the other side of the firstelectrostatic beam deflection unit 409. The first electrostatic beamdeflection unit 409, the first multi-pole unit 409A, and the secondmulti-pole unit 409B may be set for the purposes of setting the particlebeam in respect of the axis of the third electrostatic lens 407 and theentrance window of a beam deflection device 410. The first electrostaticbeam deflection unit 409, the first multi-pole unit 409A and the secondmulti-pole unit 409B may interact like a Wien filter. A further magneticdeflection element 432 may be arranged at the entrance to the beamdeflection device 410.

The beam deflection device 410 may be used as a particle beam deflector,which deflects the particle beam in a specific manner. The beamdeflection device 410 may comprise a plurality of magnetic sectors,specifically a first magnetic sector 411A, a second magnetic sector411B, a third magnetic sector 411C, a fourth magnetic sector 411D, afifth magnetic sector 411E, a sixth magnetic sector 411F, and a seventhmagnetic sector 411G. The particle beam enters the beam deflectiondevice 410 along the first optical axis OA1 and said particle beam maybe deflected by the beam deflection device 410 in the direction of asecond optical axis OA2. The beam deflection may be performed by meansof the first magnetic sector 411A, by means of the second magneticsector 411B and by means of the third magnetic sector 411C through anangle of 30° to 120°. The second optical axis OA2 may be oriented at thesame angle with respect to the first optical axis OA1. The beamdeflection device 410 also may deflect the particle beam which may beguided along the second optical axis OA2, to be precise in the directionof a third optical axis OA3. The beam deflection may be provided by thethird magnetic sector 411C, the fourth magnetic sector 411D, and thefifth magnetic sector 411E. In the embodiment in FIG. 3, the deflectionwith respect to the second optical axis 0A2 and with respect to thethird optical axis OA3 may be provided by deflection of the particlebeam at an angle of 90°. Hence, the third optical axis OA3 extendscoaxially with respect to the first optical axis OA1. However, referenceis made to the fact that the particle beam apparatus 400 according toembodiments of the system described herein described here is notrestricted to deflection angles of 90°. Rather, any suitable deflectionangle may be selected by the beam deflection device 410, for example 70°or 110°, such that the first optical axis OA1 does not extend coaxiallywith respect to the third optical axis OA3. In respect of furtherdetails of the beam deflection device 410, reference is made to WO2002/067286 A2.

After the particle beam has been deflected by the first magnetic sector411A, the second magnetic sector 411B, and the third magnetic sector411C, the particle beam may be guided along the second optical axis OA2.The particle beam may be guided to an electrostatic mirror 414 and maytravel on its path to the electrostatic mirror 414 along a fourthelectrostatic lens 415, a third multi-pole unit 416A in the form of amagnetic deflection unit, a second electrostatic beam deflection unit416, a third electrostatic beam deflection unit 417, and a fourthmulti-pole unit 416B in the form of a magnetic deflection unit. Theelectrostatic mirror 414 may comprise a first mirror electrode 413A, asecond mirror electrode 413B, and a third mirror electrode 413C.Electrons of the particle beam which are reflected back at theelectrostatic mirror 414 once again may travel along the second opticalaxis OA2 and re-enter the beam deflection device 410. Then, they may bedeflected to the third optical axis OA3 by the third magnetic sector411C, the fourth magnetic sector 411D, and the fifth magnetic sector411E.

The electrons of the particle beam may emerge from the beam deflectiondevice 410 and said electrons may be guided along the third optical axisOA3 to an object receiving container 425, at which an object to beexamined may be arranged. The object receiving container 425 may bearranged at a holding device 114 in turn. On the path to the object, theparticle beam may be guided to a fifth electrostatic lens 418, a beamguiding tube 420, a fifth multi-pole unit 418A, a sixth multi-pole unit418B, and an objective lens 421. The fifth electrostatic lens 418 may bean electrostatic immersion lens. By way of the fifth electrostatic lens418, the particle beam may be decelerated or accelerated to an electricpotential of the beam guiding tube 420.

By means of the objective lens 421, the particle beam may be focusedinto a focal plane in which the object is arranged. The holding device114 may be arranged at a movable object stage 424. The movable objectstage 424 may be arranged in a sample chamber 426 of the particle beamapparatus 400. The object stage 424 may be embodied to be movable inthree directions arranged perpendicular to one another, specifically inan x-direction (first stage axis), in a y-direction (second stage axis),and in a z-direction (third stage axis). Moreover, the object stage 424may be rotated about two rotation axes which may be arrangedperpendicular to one another (stage rotation axes).

In a further embodiment of the particle beam apparatus 400, the holdingdevice 114 may be embodied as an object receiving device, for example inthe form of a manipulator and/or a gripper for holding the objectreceiving container 425. Then, the holding device 114 may have a movableembodiment, for example as explained above and further below in respectof the object stage 424.

The sample chamber 426 may be under vacuum. For the purposes ofproducing the vacuum, a pump (not illustrated) may be arranged at thesample chamber 426. In the embodiment illustrated in FIG. 3, the samplechamber 426 may be operated in a first pressure range or in a secondpressure range. The first pressure range may comprise only pressures ofless than or equal to 10⁻³ hPa, and the second pressure range maycomprise only pressures of greater than 10⁻³ hPa. To ensure saidpressure ranges, the sample chamber 426 may be vacuum-sealed.

The objective lens 421 may be embodied as a combination of a magneticlens 422 and a sixth electrostatic lens 423. The end of the beam guidingtube 420 further may be an electrode of an electrostatic lens. Afteremerging from the beam guiding tube 420, particles of the particle beamapparatus 400 may be decelerated to a potential of the object. Theobjective lens 421 may not be restricted to a combination of themagnetic lens 422 and the sixth electrostatic lens 423. Rather, theobjective lens 421 may assume any suitable form. By way of example, theobjective lens 421 also may be embodied as a purely magnetic lens or asa purely electrostatic lens.

The particle beam which is focused onto the object may interact with theobject. Interaction particles may be generated. In particular, secondaryelectrons may be emitted from the object or backscattered electrons maybe backscattered at the object. The secondary electrons or thebackscattered electrons may be accelerated again and guided into thebeam guiding tube 420 along the third optical axis OA3. In particular,the trajectories of the secondary electrons and the backscatteredelectrons extend on the route of the beam path of the particle beam inthe opposite direction to the particle beam.

The particle beam apparatus 400 may comprise a first analysis detector419, which may be arranged between the beam deflection device 410 andthe objective lens 421 along the beam path. Secondary electronstraveling in directions oriented at a large angle with respect to thethird optical axis OA3 may be detected by the first analysis detector419. Backscattered electrons and secondary electrons which have a smallaxial distance with respect to the third optical axis OA3 at thelocation of the first analysis detector 419—i.e., backscatteredelectrons and secondary electrons which have a small distance from thethird optical axis OA3 at the location of the first analysis detector419—may enter the beam deflection device 410 and be deflected to asecond analysis detector 428 by the fifth magnetic sector 411E, thesixth magnetic sector 411F and the seventh magnetic sector 411G along adetection beam path 427. By way of example, the deflection angle is 90°or 110°.

The first analysis detector 419 may generate detection signals which maybe largely generated by emitted secondary electrons. The detectionsignals which are generated by the first analysis detector 419 may beguided to a control unit 123 and may be used to obtain information aboutthe properties of the interaction region of the focused particle beamwith the object. In particular, the focused particle beam may be scannedover the object using a scanning device 429. By means of the detectionsignals generated by the first analysis detector 419, an image of thescanned region of the object then may be generated and displayed on adisplay unit. The display unit is, for example, a monitor 124 that maybe arranged at the control unit 123.

The second analysis detector 428 also may be connected to the controlunit 123. Detection signals of the second analysis detector 428 may bepassed to the control unit 123 and used to generate an image of thescanned region of the object and to display it on a display unit. Thedisplay unit is, for example, the monitor 124 that may be arranged atthe control unit 123.

Arranged at the sample chamber 426 may be a radiation detector 500,which may be used to detect interaction radiation, for example x-rayradiation and/or cathodoluminescence light. The radiation detector 500may be connected to the control unit 123, which may have the monitor124. The control unit 123 may process detection signals of the radiationdetector 500 and displays them in the form of images on the monitor 124.

The control unit 123 may comprise a database 126, in which the controlunit 123 may store data and/or from which data may be loaded onto aprocessor of the control unit 123.

Arranged at the holding device 114 may be a cooling and/or heatingdevice 127, which may be used for cooling and/or heating the holdingdevice 114, the object receiving container 425 and/or the object. Thisis discussed in more detail further below.

To determine a temperature of the object, a temperature of the holdingdevice 114, a temperature of the object receiving container 125 and/or atemperature of the object stage 424, a temperature measuring unit 128may be arranged in the sample chamber 426. By way of example, thetemperature measuring unit 128 may be embodied as an infrared measuringapparatus or as a semiconductor temperature sensor. However, the systemdescribed herein is not restricted to the use of such temperaturemeasuring units. Rather, any temperature measuring unit which issuitable for the system described herein may be used as temperaturemeasuring unit.

The control unit 123 of the particle beam apparatus 400 may comprise theprocessor or may be embodied as a processor. A computer program productthat controls the particle beam apparatus 400 in such a way that themethod according to embodiments of the system described herein iscarried out may be loaded onto the processor. This is discussed in moredetail further below.

FIG. 4 shows a schematic illustration of a light microscope 800. Thelight microscope 800 may comprise a light source 801 for generatinglight and an optical unit 802 in the form of an objective for guidingthe light to an object, which may be arranged on an object receivingcontainer 125. Further, the light microscope 800 may be provided with aholding device 114 for holding the object receiving container 125.Moreover, the light microscope 800 may be embodied with a movablyembodied object stage 122, arranged at which may be the holding device114 and hence also the object receiving container 125.

The object stage 122 of the light microscope 800 may be embodied to bemovable, for example, along a first translation axis (in particular anx-axis), along a second translation axis (in particular a y-axis), andalong a third translation axis (in particular a z-axis). By way ofexample, the first translation axis, the second translation axis, andthe third translation axis may be oriented perpendicular to one another.Further, the object stage 122 may be for example embodied to berotatable about a first axis of rotation and about a second axis ofrotation, which may be aligned perpendicular to the first axis ofrotation. In one embodiment of the light microscope 800, a respectivemotor may be provided for each of the aforementioned axes, said motorfacilitating the movement along the corresponding axis.

In a further embodiment of the light microscope 800, the holding device114 may be embodied as an object receiving device, for example in theform of a manipulator and/or a gripper for holding the object receivingcontainer 125. Then, the holding device 114 may have a movableembodiment, for example as explained above and further below in respectof the object stage 122.

The light microscope 800 may comprise a control unit 123, which may beprovided with a monitor 124 on which images of the object recorded withthe light microscope 800 may be displayable.

The control unit 123 may comprise a database 126, in which the controlunit 123 may store data and/or from which data may be loaded onto aprocessor of the control unit 123.

Arranged at the holding device 114 may be a cooling and/or heatingdevice 127, which may be used for cooling and/or heating the holdingdevice 114, the object receiving container 125 and/or the object. Thisis discussed in more detail further below.

To determine a temperature of the object, a temperature of the holdingdevice 114 and/or a temperature of the object stage 122, the lightmicroscope 800 may comprise a temperature measuring unit 128. By way ofexample, the temperature measuring unit 128 may be embodied as aninfrared measuring apparatus or as a semiconductor temperature sensor.However, the system described herein is not restricted to the use ofsuch temperature measuring units. Rather, any temperature measuring unitwhich is suitable for the system described herein may be used astemperature measuring unit.

The control unit 123 of the light microscope 800 may comprise theprocessor or may be embodied as a processor. A computer program productthat controls the light microscope 800 in such a way that the methodaccording to embodiments of the system described herein is carried outmay be loaded onto the processor. This is discussed in more detailfurther below.

FIG. 4A shows a schematic illustration of an apparatus 800A forprocessing an object. The apparatus 800A for processing an object maycomprise a processing device 801A for processing the object. By way ofexample, the processing device 801A may be embodied as a mechanicalcutting device and/or as a laser cutting device and/or as a device forelectron beam-induced deposition of layers on the object, for exampleusing a gas, and/or as a device for ion beam-induced deposition oflayers on the object, for example using a gas, and/or as a sputteringapparatus. The object may be arranged at an object receiving container125. Further, the apparatus 800A for processing an object may beprovided with a holding device 114 for holding the object receivingcontainer 125. Moreover, the apparatus 800A for processing an object maybe embodied with a movably embodied object stage 122, arranged at whichmay be the holding device 114 and hence also the object receivingcontainer 125.

The object stage 122 of the apparatus 800A for processing an object maybe embodied to be movable, for example along a first translation axis(in particular an x-axis), along a second translation axis (inparticular a y-axis) and along a third translation axis (in particular az-axis). By way of example, the first translation axis, the secondtranslation axis, and the third translation axis may be orientedperpendicular to one another. Further, the object stage 122 may be forexample embodied to be rotatable about a first axis of rotation andabout a second axis of rotation, which may be aligned perpendicular tothe first axis of rotation. In one embodiment of the apparatus 800A forprocessing an object, each of the aforementioned axes is respectivelyassociated with a motor which facilitates the movement along thecorresponding axis.

In a further embodiment of the apparatus 800A for processing an object,the holding device 114 may be embodied as an object receiving device,for example in the form of a manipulator and/or a gripper for holdingthe object receiving container 125. Then, the holding device 114 mayhave a movable embodiment, for example as explained above and furtherbelow in respect of the object stage 122.

Arranged at the holding device 114 may be a cooling and/or heatingdevice 127, which may be used for cooling and/or heating the holdingdevice 114, the object receiving container 125 and/or the object. Thisis discussed in more detail further below.

To determine a temperature of the object, a temperature of the holdingdevice 114 and/or a temperature of the object stage 122, the apparatus800A for processing an object may comprise a temperature measuring unit128. By way of example, the temperature measuring unit 128 may beembodied as an infrared measuring apparatus or as a semiconductortemperature sensor. However, the system described herein is notrestricted to the use of such temperature measuring units. Rather, anytemperature measuring unit which is suitable for the system describedherein may be used as temperature measuring unit.

A control unit 123 of the apparatus 800A for processing an object maycomprise a processor or may be embodied as a processor. Loaded onto theprocessor may be a computer program product which controls the apparatus800A for processing an object in such a way that the method according toembodiments of the system described herein may be carried out. This isdiscussed in more detail further below.

Now, in the following, the object stage 122, 424 of the above-discussedparticle beam apparatuses 100, 200 and 400, of the light microscope 800and of the apparatus 800A for processing an object is discussed in moredetail. The object stage 122, 424 may be embodied as a movable objectstage, which is illustrated schematically in FIGS. 5 and 6. Reference ismade to the fact that the system described herein is not restricted tothe object stage 122, 424 described here. Rather, the system describedherein may include any movable object stage that is suitable for thesystem described herein. In a further embodiment, the holding device 114may be embodied as an object receiving device, for example in the formof a manipulator and/or a gripper for holding the object receivingcontainer 125. Then, the holding device 114 may have a movableembodiment, for example as explained above and further below in respectof the object stage 122, 424.

The holding device 114 may be arranged at the object stage 122, 424,either directly or using a transportation device, with the objectreceiving container 125, 425 with the object being arranged, in turn, inthe holding device 114. The object stage 122, 424 may have movementelements that ensure a movement of the object stage 122, 424 in such away that a region of interest on the object may be examined, forexample, by means of a particle beam and/or a light beam. The movementelements are illustrated schematically in FIGS. 5 and 6 and areexplained below.

The object stage 122, 424 may have a first movement element 600, whichmay be arranged, for example, data housing 601 of the sample chamber120, 201 or 426, in which the object stage 122, 424 may be arranged inturn. The first movement element 600 may enable a movement of the objectstage 122, 424 along the z-axis (third stage axis). Further, a secondmovement element 602 may be provided. The second movement element 602may enable a rotation of the object stage 122, 424 about a first stagerotation axis 603, which also may be referred to as a tilt axis. Thissecond movement element 602 may serve to tilt an object arranged at theobject receiving container 125, 425 about the first stage rotation axis603, wherein the object receiving container 125, 425 may be arranged atthe holding device 114.

Arranged at the second movement element 602, in turn, may be a thirdmovement element 604 that may be embodied as a guide for a slide andthat may ensure that the object stage 122, 424 may be movable in thex-direction (first stage axis). The aforementioned slide may be afurther movement element in turn, namely a fourth movement element 605.The fourth movement element 605 may be embodied in such a way that theobject stage 122, 424 is movable in the y-direction (second stage axis).To this end, the fourth movement element 605 may have a guide in which afurther slide is guided, a holding device 114 with the object receivingcontainer 125, 425 in turn being arranged at the latter.

The holding device 114 may be embodied, in turn, with a fifth movementelement 606 that facilitates a rotation of the holding device 114 andhence also the object receiving container 125, 425 about a second stagerotation axis 607. The second stage rotation axis 607 may be orientedperpendicular to the first stage rotation axis 603.

On account of the above-described arrangement, the object stage 122, 424of the embodiment discussed here may have the following kinematic chain:first movement element 600 (movement along the z-axis)—second movementelement 602 (rotation about the first stage rotation axis 603)—thirdmovement element 604 (movement along the x-axis)—fourth movement element605 (movement along the y-axis)—fifth movement element 606 (rotationabout the second stage rotation axis 607).

In a further embodiment (not illustrated), further movement elements maybe arranged at the object stage 122, 424 such that movements alongfurther translational axes and/or about further rotation axes may bemade possible.

It should be clear from FIG. 6 that each of the aforementioned movementelements may be connected to a drive unit in the form of a motor M1 toM5. Thus, the first movement element 600 may be connected to a firstdrive unit M1 and may be driven on account of a driving force that maybe provided by the first drive unit M1. The second movement element 602may be connected to a second drive unit M2, which drives the secondmovement element 602. The third movement element 604 may be connected,in turn, to a third drive unit M3. The third drive unit M3 provides adriving force for driving the third movement element 604. The fourthmovement element 605 may be connected to a fourth drive unit M4, whereinthe fourth drive unit M4 drives the fourth movement element 605.Furthermore, the fifth movement element 606 may be connected to a fifthdrive unit M5. The fifth drive unit M5 provides a driving force thatdrives the fifth movement element 606.

The aforementioned drive units M1 to M5 may be embodied as steppermotors, for example, and may be controlled by a control unit 608 and maybe each supplied with a supply current by the control unit 608 (cf. FIG.6). It is explicitly pointed out that the system described herein is notrestricted to the movement by means of stepper motors. Rather, any driveunits may be used as drive units, for example brushless motors. Bysupplying the supply current to the drive units M1 to M5, the driveunits M1 to M5 may be controlled in such a way that the object stage122, 424 may be moved to a desired position, for example in the samplechamber 120, 201, 426. The object stage 122, 424 may be held in thisdesired position by means of the drive units M1 to M5. Expresseddifferently, the object stage 122, 424 should no longer move away fromthis desired position. This may be desirable, in particular for a goodresolution and/or accurate imaging of an object arranged on the objectstage 122, 424. When the drive units M1 to M5 are stopped, the amplitudeof the supply current may be lowered to a specifiable holding amplitudefor each of the drive units M1 to M5. The supply current with thisholding amplitude also may be referred to as a holding current. When thesupply current is at the holding current for each of the drive units M1to M5, the object stage 122, 424 may remain at the desired position.

FIG. 7 shows an embodiment of the object receiving container 125. Theobject receiving container 125 may comprise a first container unit 129and a second container unit 130. A first cavity 131 and a second cavity132 may be arranged at the first container unit 129. The first cavity131 may be embodied to receive a first object. Further, the secondcavity 132 may be embodied to receive a second object.

Moreover, the object receiving container 125 may comprise a hinge device134, which may be arranged both at the first container unit 129 and atthe second container unit 130. The second container unit 130 may have amovable embodiment relative to the first container unit 129 on accountof the hinge device 134. The second container unit 130 may be able to bebrought into a first position and/or into a second position relative tothe first container unit 129.

The first cavity 131 may comprise a first cavity opening 136 and asecond cavity opening 138 (cf. FIGS. 7 and 9). The first cavity opening136 and the second cavity opening 138 of the first cavity 131 delimitthe first cavity 131. Further, the first cavity opening 136 and thesecond cavity opening 138 of the first cavity 131 may be arrangedopposite one another. Moreover, the second cavity 132 may comprise afirst cavity opening 137 and a second cavity opening 139 (cf. FIGS. 7and 9). The first cavity opening 137 and the second cavity opening 139of the second cavity 132 delimit the second cavity 132. Further, thefirst cavity opening 137 and the second cavity opening 139 of the secondcavity 132 may be arranged opposite one another.

FIG. 8 shows the second position of the second container unit 130relative to the first container unit 129. In the second position of thesecond container unit 130 relative to the first container unit 129, thefirst cavity opening 136 of the first cavity 131 and the first cavityopening 137 of the second cavity 132 may be arranged at the secondcontainer unit 130. Consequently, the second container unit 130 maycover the first cavity opening 136 of the first cavity 131 and the firstcavity opening 137 of the second cavity 132 in the second position ofthe second container unit 130 relative to the first container unit 129.Then, the first object arranged in the first cavity 131 may not beaccessible through the first cavity opening 136 of the first cavity 131.Further, the second object arranged in the second cavity 132 then maynot be accessible through the first cavity opening 137 of the secondcavity 132. FIG. 7 shows the first position of the second container unit130 relative to the first container unit 129. In the first position ofthe second container unit 130 relative to the first container unit 129,the first cavity opening 136 of the first cavity 131 and the firstcavity opening 137 of the second cavity 132 may be freely accessible atthe first container unit 129. Then, the first object arranged in thefirst cavity 131 may be accessible through the first cavity opening 136of the first cavity 131. Further, the second object arranged in thesecond cavity 132 then may be accessible through the first cavityopening 137 of the second cavity 132.

In one embodiment of the object receiving container 125, a coveringdevice 140 for covering the second cavity opening 138 of the firstcavity 131 and the second cavity opening 139 of the second cavity 132 isarranged at the second cavity opening 138 of the first cavity 131 and atthe second cavity opening 139 of the second cavity 132 (cf. FIGS. 7 and9). The covering device 140 may be embodied as a slider device andarranged in a receptacle at the first container unit 129 in such a waythat the covering device 140 is displaceable relative to the secondcavity opening 138 of the first cavity 131 and to the second cavityopening 139 of the second cavity 132. In this way, the covering device140 may be able to be brought into a covering position (cf. FIG. 7) andan exposing position (cf. FIG. 9). In the covering position, thecovering device 140 may cover the second cavity opening 138 of the firstcavity 131 and the second cavity opening 139 of the second cavity 132.Expressed differently, the covering device 140 seals the first cavity131 and the second cavity 132 in the region of the second cavity opening138 of the first cavity 131 and in the region of the second cavityopening 139 of the second cavity 132 in the covering position. In theexposing position, the covering device 140 does not seal the firstcavity 131 and the second cavity 132 in the region of the second cavityopening 138 of the first cavity 131 and in the region of the secondcavity opening 139 of the second cavity 132. Then, the first objectarranged in the first cavity 131 may be accessible through the secondcavity opening 138 of the first cavity 131. Further, the second objectarranged in the second cavity 132 then may be accessible through thesecond cavity opening 139 of the second cavity 132. The aforementionedembodiments may be advantageous if examinations of the first objectand/or the second object are performed, within the scope of which aparticle beam may be transmitted through the first object and/or thesecond object. The transmitted particles of the particle beam then maybe detected. Interaction particles which arise on account of aninteraction of the particle beam with the first object may emerge at aside of the first object which may be arranged at the second cavityopening 138 of the first cavity 131. Furthermore, interaction particleswhich arise on account of an interaction of the particle beam with thesecond object may emerge at a side of the second object which may bearranged at the second cavity opening 139 of the second cavity 132. Theinteraction particles and/or the transmitted particles of the particlebeam then may be detected using a detector, for example the thirddetector 121.

Consequently, in the above-described embodiment, firstly, the firstcavity opening 136 of the first cavity 131 and the first cavity opening137 of the second cavity 132 and, secondly, the second cavity opening138 of the first cavity 131 and the second cavity opening 139 of thesecond cavity 132 may be covered by different units. The first cavityopenings 136, 137 may be covered by the second container unit 130. Bycontrast, the second cavity openings 138, 139 may be covered by thecovering device 140.

As illustrated in FIGS. 7 to 9, the object receiving container 125 maycomprise a fastening device 133, which may be arranged at the firstcontainer unit 129. In addition or as an alternative thereto, thefastening device 133 may be arranged at the second container unit 130.The fastening device 133 may serve to arrange the object receivingcontainer 125 at the holding device 114, as yet to be explained in moredetail below.

In the embodiment of the object receiving container 125 illustrated inFIGS. 7 to 9, the fastening device 133 may be embodied as a springdevice. The fastening device 133 may have a first spring end 141 and asecond spring end 142. The first spring end 141 and the second springend 142 may be arranged at a distance from one another. Further, thefirst spring end 141 may be embodied so as to be movable relative to thesecond spring end 142. Expressed differently, the first spring end 141and/or the second spring end 142 may have a movable embodiment. Thefirst spring end 141 may have a first engagement opening 143 for theengagement of an actuation tool. Moreover, the second spring end 142 mayhave a second engagement opening 144 for the engagement of the actuationtool. This may ensure a simple operation of the fastening device 133 inthe form of the spring device, and so the object receiving container 125may be able to be easily mounted on the holding device 114 and may beeasily detachable from the holding device 114 again, as will beexplained in more detail below.

In a further embodiment of the object receiving container 125, thefastening device 133 may comprise at least one snap ring and/or may beembodied as a snap ring. In an even further embodiment of the objectreceiving container 125, the fastening device 133 may comprise aclamping device or may be embodied as a clamping device. In particular,the fastening device 133 may have a first clamping part and a secondclamping part. In addition or as an alternative thereto, the fasteningdevice 133 may comprise a screw and/or an eccentric disk, wherein thescrew and/or the eccentric disk may be used to clamp the objectreceiving container 125 against the holding device 114.

In the embodiment of the object receiving container 125 illustrated inFIGS. 7 to 9, the first container unit 129 may have a first surface 145,wherein the first surface 145 may be arranged in a first plane. Further,the second container unit 130 may have a second surface 146, wherein thesecond surface 146 may be arranged in a second plane. As illustrated inFIG. 8, the first surface 145 of the first container unit 129 restsagainst the second surface 146 of the second container unit 130 in thesecond position of the second container unit 130 relative to the firstcontainer unit 129, and so the first cavity 131 arranged at the firstcontainer unit 129 and the second cavity 132 may be covered by thesecond surface 146 of the second container unit 130. FIG. 7 shows thefirst position of the second container unit 130 relative to the firstcontainer unit 129. In the first position, the first surface 145 of thefirst container unit 129 may be arranged with respect to the secondsurface 146 of the second container unit 130 in such a way that thefirst plane is aligned with respect to the second plane as follows: (i)the first plane is aligned parallel to the second plane or (ii) thefirst plane is identical to the second plane or (iii) the first plane isaligned at an angle of more than 5° with respect to the second plane.

FIG. 10 shows a further perspective view of the object receivingcontainer 125 having the features already discussed further above.Further, FIG. 10 shows a clamping unit 135, which is likewiseillustrated in FIGS. 7 and 9. The function of the clamping unit 135 willbe discussed in more detail below.

FIG. 11 shows a further embodiment of the object receiving container125. This embodiment of the object receiving container 125 also maycomprise a first container unit 129 and a second container unit 130. Afirst cavity 131 may be arranged at the first container unit 129. Thefirst cavity 131 may be embodied to receive a first object. The firstcavity 131 may have a first cavity opening 136. The first cavity opening136 delimits the first cavity 131.

In the embodiment of the object receiving container 125 illustrated inFIG. 11, the second container unit 130 may be embodied as a displacingdevice such that the second container unit 130 is displaceable into afirst position and/or into a second position relative to the firstcontainer unit 129. Expressed differently, the first container unit 129and/or the second container unit 130 may be displaceable such that thesecond container unit 130 may be arranged in the first position and/orin the second position relative to the first container unit 129. Thesecond container unit 130 may cover the first cavity 131 arranged at thefirst container unit 129 when the second container unit 130 is in thesecond position relative to the first container unit 129. If a pluralityof cavities are arranged at the first container unit 129, the secondcontainer unit 130 may cover the plurality of cavities in the secondposition of the second container unit 130 relative to the firstcontainer unit 129. FIG. 11 shows the first position of the secondcontainer unit 130 relative to the first container unit 129. The firstcavity 131 and hence the first object arranged in the first cavity 131may be accessible in the first position of the second container unit 130relative to the first container unit 129. Therefore, the first objectmay be examined, analyzed and/or processed. If a plurality of cavitiesare arranged at the first container unit 129, then the plurality ofcavities and hence the objects arranged in the plurality of cavities maybe accessible in the first position of the second container unit 130relative to the first container unit 129.

The embodiment of the object receiving container 125 illustrated in FIG.11 may comprise a fastening device 133, which may be arranged at thefirst container unit 129. The fastening device 133 may be embodied as aspring device. The fastening device 133 of this embodiment, too, mayhave a first spring end 141 and a second spring end 142. The firstspring end 141 and the second spring end 142 may be arranged at adistance from one another. Further, the first spring end 141 may beembodied so as to be movable relative to the second spring end 142.Expressed differently, the first spring end 141 and/or the second springend 142 may have a movable embodiment. Due to the fastening device 133in the form of the spring device it may be ensured that the objectreceiving container 125 is able to be easily mounted on the holdingdevice 114 and is easily detachable from the holding device 114 again,as will be explained in more detail below.

FIG. 12 shows an embodiment of a mounting device 147, by means of which,for example, the first object may be arranged in the first cavity 131and the second object may be arranged in the second cavity 132 of theobject receiving container 125 as per FIGS. 7 to 10. The mounting device147 may have an interior 148, which may be surrounded by an insulatedwall 149. A holder 150 for the object receiving container 125 may bearranged in the interior 148. The holder 150 may comprise a first holderpart 151 and a second holder part 152, which may be interconnected byway of a hinge 153. The first holder part 151 may be positioned relativeto the second holder part 152 in order to ensure that it is easy tomount the first object in the first cavity 131 and the second object inthe second cavity 132 of the object receiving container 125.

The object receiving container 125 may be arranged in a receptacle 154of the holder 150 in order to mount the first object in the first cavity131 and the second object in the second cavity 132 of the objectreceiving container 125. The object receiving container 125 may befastened in the receptacle 154 by means of the fastening device 133. Tothis end, an actuation tool engages in the first engagement opening 143of the first spring end 141 and in the second engagement opening 144 ofthe second spring end 142. Thereupon, the first spring end 141 and thesecond spring end 142 may be moved toward one another. Subsequently, theobject receiving container 125 may be inserted in the receptacle 154. Byremoving the actuation tool from the first engagement opening 143 of thefirst spring end 141 and from the second engagement opening 144 of thesecond spring end 142, the first spring end 141 and the second springend 142 move apart, and so an outer surface of the fastening device 133rests against an inner surface of the receptacle 154. In this way, theobject receiving container 125 may be held in clamping fashion in thereceptacle 154.

By filling the interior 148 of the mounting device 147, for example withliquid nitrogen or liquid helium, the object receiving container 125 maybe cooled to cryo-temperatures, and so the first object may be mountedin the first cavity 131 and the second object may be mounted in thesecond cavity 132 of the object receiving container 125 undercryo-temperatures. To this end, the clamping unit 135, which may beembodied as a spring, may be raised by a rod-shaped unit 155 (cf. FIGS.13 and 14), and so the first object is insertable into the first cavity131 and the second object is insertable into the second cavity 132 ofthe object receiving container 125. Subsequently, the clamping unit 135may be lowered by the rod-shaped unit 155, and so the first object isheld in securely clamping fashion in the first cavity 131 and the secondobject is held in securely clamping fashion in the second cavity 132 ofthe object receiving container 125. By way of example, the rod-shapedunit 155 may be raised and lowered using a sliding-block guide 156. Bymoving an actuation unit 157, the rod-shaped unit 155 is, firstly, movedalong the sliding-block guide 156 and, secondly, raised or lowered.

In a further embodiment, the first object may be initially arranged at afirst holder and/or the second object may be arranged at a secondholder. Subsequently, the first holder may be inserted together with thefirst object into the first cavity 131. Further, the second holder maybe inserted together with the second object into the second cavity 132.Subsequently, the clamping unit 135 may be lowered by the rod-shapedunit 155, and so the first holder together with the first object is heldin securely clamping fashion in the first cavity 131 and the secondholder together with the second object is held in securely clampingfashion in the second cavity 132 of the object receiving container 125.This embodiment is illustrated in FIG. 15. FIG. 15 shows a furtherperspective illustration of the object receiving container 125, whereina first holder 160 is arranged in the first cavity 131, with, in turn, afirst object 158 being arranged at the first holder 160. A second holder161 may be arranged in the second cavity 132, with, in turn, a secondobject 159 being arranged at the second holder 161. By way of example,the first holder 160 and/or the second holder 161 may be configured ascommercially available TEM sample holders in the form of so-called gridsor U-shaped embodied holders.

FIG. 16 shows an embodiment of the holding device 114. By way ofexample, the holding device 114 may be an adapter device, which may bearranged at the object stage 122, 424 of the SEM 100, of the combinationapparatus 200, of the particle beam apparatus 400 and/or of the lightmicroscope 800. In addition or as an alternative thereto, the holdingdevice 114 may be arranged at a receiving device of the apparatus 800Afor processing an object, for example of a microtome, a laser cuttingappliance and/or a polishing appliance.

In order to arrange the object receiving container 125 at the holdingdevice 114, the object receiving container 125 may be arranged in areceptacle 162 of the holding device 114. To this end, the actuationtool engages in the first engagement opening 143 of the first spring end141 and in the second engagement opening 144 of the second spring end142. Thereupon, the first spring end 141 and the second spring end 142may be moved toward one another. Subsequently, the object receivingcontainer 125 may be inserted into the receptacle 162 of the holdingdevice 114. By removing the actuation tool from the first engagementopening 143 of the first spring end 141 and from the second engagementopening 144 of the second spring end 142, the first spring end 141 andthe second spring end 142 move apart, and so an outer surface of thefastening device 133 rests against an inner surface of the receptacle162 of the holding device 114. In this way, the object receivingcontainer 125 may be held in clamping fashion in the receptacle 162 ofthe holding device 114.

In a further embodiment of the holding device 114, the arrangement ofthe object receiving container 125 may be implemented by a differentlyconfigured fastening device 133. By way of example, the fastening device133 may comprise at least one snap ring and/or may be embodied as a snapring. In an even further embodiment, the fastening device 133 maycomprise a clamping device or may be embodied as a clamping device. Inparticular, the fastening device 133 may have a first clamping part anda second clamping part. In addition or as an alternative thereto, thefastening device 133 may comprise a screw and/or an eccentric disk,wherein the screw and/or the eccentric disk may be used to clamp theobject receiving container 125 against the holding device 114.

As already mentioned, the holding device 114 may have any suitableconfiguration which is necessary in order to be arranged, for example,at the object stage 122, 424 of the SEM 100, of the combinationapparatus 200, of the particle beam apparatus 400 and/or of the lightmicroscope 800. In addition or as an alternative thereto, the holdingdevice 114 may be configured in such a way that the holding device 114may be arranged at the apparatus 800A for processing an object, forexample at a microtome, at a laser cutting appliance and/or at apolishing appliance.

FIG. 17 shows a further embodiment of the holding device 114. Thisembodiment of the holding device 114 may comprise a base plate 163, thesides of which may be delimited by a first strip 164, a second strip 165and a third strip 166 in such a way that the first strip 164, the secondstrip 165 and the third strip 166 delimit the receptacle 162 of theholding device 114. The object receiving container 125 may be arrangedin the receptacle 162. In FIG. 17, the second container unit 130 may bearranged in the second position relative to the first container unit129.

FIG. 18 shows the embodiment of the holding device 114 as per FIG. 16,but from a different perspective. Therefore, reference is initially madeto the explanations above. Further, in FIG. 18, the second containerunit 130 may be arranged in the second position relative to the firstcontainer unit 129.

FIG. 19 shows an even further embodiment of the holding device 114. Thisembodiment of the holding device 114 may have an oblique surface 167 inrespect of a main body 168. The oblique surface 167 may be delimited bya first strip 164, a second strip 165 and a third strip 166 in such away that the first strip 164, the second strip 165 and the third strip166 engage around the receptacle 162 of the holding device 114. Theobject receiving container 125 may be arranged in the receptacle 162. Onaccount of the oblique surface 167, it may be no longer mandatory torotate the holding device 114, and hence also the object receivingcontainer 125, about an axis of rotation, for example in the samplechamber 120 of the SEM 100, in the sample chamber 201 of the combinationapparatus 200, in the sample chamber 426 of the particle beam apparatus400 and/or in the light microscope 800.

Embodiments of methods according to the system described herein aredescribed in more detail below. Explicit reference is made to the factthat these embodiments should only be understood as illustrative andthat the system described herein is not restricted to these embodiments.

FIG. 20 initially shows preparatory method steps of a method forexamining, analyzing and/or processing an object. Initially, an object,for example the first object 158 or the second object 159, may bearranged at a holder in a method step S1. By way of example, the holdermay be a commercially available TEM object holder. Subsequently, inmethod step S2, the holder may be arranged together with the object 158,159, for example in the first cavity 131 or in the second cavity 132 ofthe object receiving container 125. This may be implemented with themounting device 147, in which the object receiving container 125 may bearranged. The arrangement of the holder together with the object 158,159, for example in the first cavity 131 or in the second cavity 132 ofthe object receiving container 125, was already described above.Therefore, reference is made to all the explanations provided above inrespect of the arrangement of the holder together with the object 158,159 in the object receiving container 125. In method step S3, at leastone marking may be applied to the object receiving container 125, saidmarking being used as a reference marking for orientation and navigationpurposes during the subsequent examination, analysis and/or processingin an apparatus, for example in one of the apparatuses already mentionedabove. The object 158, 159 may be cleaned in method step S4, for examplefrom contaminations consisting of ice. Further, information items may becreated in method step S5, said information items being obtained, forexample, by means of a light-microscopic examination of the object 158,159 by using the light microscope 800. By way of example, theseinformation items comprise the orientation of the object 158, 159, thelocation of contaminants present on the object 158, 159 and/or thethickness of a layer of ice on the object 158, 159. Moreover, the objectreceiving container 125 may be arranged in a storage container or atransportation container in method step S6. Both the storage containerand the transportation container may be cooled, for example with liquidnitrogen or liquid helium. In the transportation container, the objectreceiving container 125 may be transported from a first examination,analysis and/or processing apparatus to a second examination, analysisand/or processing apparatus.

FIG. 21 shows an optional method step S7 for a method for examining,analyzing and/or processing the object 158, 159. Here, following methodstep S6, the object 158, 159 may be transported in the transportationcontainer to the light microscope 800 in method step S7. The objectreceiving container 125 may be taken from the transportation containerand arranged at the holding device 114. The holding device 114 may besuitable for introduction into the light microscope 800. The holdingdevice 114 may be introduced together with the object receivingcontainer 125 into the light microscope 800. Subsequently, the secondcontainer unit 130 may be moved relative to the first container unit 129in such a way that the second container unit 130 may be arranged in thefirst position relative to the first container unit 129. In the firstposition of the second container unit 130, the object 158, 159 arranged,for example, in the first cavity 131 or in the second cavity 132 may beaccessible and may be examined using the light microscope 800 by way ofwide field light microscopy. The examination results and analysisresults in respect of the object 158, 159 obtained in this way, inparticular the images of the object 158, 159 recorded using the lightmicroscope 800, may be used, for example, for a correlation withexamination results and analysis results in respect of the object 158,159 which may be obtained with the SEM 100, for example. Thiscorrelation of examination results and analysis results, which wereobtained using different apparatuses, also may be referred to ascorrelative microscopy. After completing the examination with the lightmicroscope 800, the second container unit 130 may be brought into thesecond position relative to the first container unit 129 such that thefirst cavity 131 and/or the second cavity 132, in which the object 158,159 may be arranged, may be sealed and the object 158, 159 may be nolonger accessible. The object receiving container 125 then may beremoved from the holding device 114 again and introduced into thetransportation container.

Subsequently, further method steps of the method for examining,analyzing and/or processing the object 158, 159 may be carried out.

FIG. 22 shows a further optional method step S8 for a method forexamining, analyzing and/or processing the object 158, 159. Followingmethod step S6 or S7, the object receiving container 125 having theobject 158, 159 may be transported in the transportation container to aconfocal laser microscope in method step S8. The object receivingcontainer 125 may be taken from the transportation container andarranged at the holding device 114. The holding device 114 may besuitable for introduction into the confocal laser microscope. Theholding device 114 may be introduced together with the object receivingcontainer 125 into the confocal laser microscope. Subsequently, thesecond container unit 130 may be moved relative to the first containerunit 129 in such a way that the second container unit 130 may bearranged in the first position relative to the first container unit 129.In the first position of the second container unit 130, the object 158,159 arranged, for example, in the first cavity 131 or in the secondcavity 132 may be accessible and may be examined using the confocallaser microscope by way of fluorescence imaging. The examination resultsand analysis results in respect of the object 158, 159 obtained in thisway may be used, for example, for a correlation with examination resultsand analysis results in respect of the object 158, 159 which may beobtained with the SEM 100, for example. After completing the examinationwith the confocal laser microscope, the second container unit 130 may bebrought into the second position relative to the first container unit129 such that, in particular, the first cavity 131 and the second cavity132, in which the object 158, 159 may be arranged, may be sealed and theobject 158, 159 may be no longer accessible. The object receivingcontainer 125 then may be removed from the holding device 114 again andintroduced into the transportation container.

Subsequently, further method steps of the method for examining,analyzing and/or processing the object may be carried out. FIG. 23 showsmethod steps of an embodiment of the method for examining, analyzingand/or processing the object 158, 159.

In method step S9, the object receiving container 125 having the object158, 159 may be transported in the transportation container to a beamapparatus, for example the SEM 100, the combination apparatus 200 and/orthe particle beam apparatus 400, or to the apparatus 800A for processingan object. The object receiving container 125 may be taken from thetransportation container and arranged at the holding device 114. Theholding device 114 may be suitable for introduction into the SEM 100,the combination apparatus 200, the particle beam apparatus 400 and/orthe apparatus 800A for processing an object. In method step S10, theholding device 114 may be arranged at a transportation device. By way ofexample, the transportation device may be a device that is movable bymeans of a manipulator, which device may be movable, in particular, froma workstation arranged at the SEM 100, at the combination apparatus 200and/or at the particle beam apparatus 400 into the sample chamber 120 ofthe SEM 100, into the sample chamber 201 of the combination apparatus200 and/or into the sample chamber 426 of the particle beam apparatus400. By way of example, such a transportation device may be referred toas a “shuttle”. In method step S11, the transportation device may betransported to the workstation and introduced therein. In theworkstation, the second container unit 130 may be moved relative to thefirst container unit 129 in such a way that the second container unit130 may be arranged in the first position relative to the firstcontainer unit 129. In the first position of the second container unit130, the object 158, 159 arranged, for example, in the first cavity 131or in the second cavity 132 may be accessible and may be processed. Byway of example, layers may be removed from the object 158, 159 by meansof a microtome or layers may be applied to the object 158, 159 by meansof a sputtering device. The workstation may be arranged at the SEM 100,at the combination apparatus 200 and/or at the particle beam apparatus400. As an alternative thereto, the workstation, for example theapparatus 800A for processing an object, may not be coupled to the SEM100, the combination apparatus 200 and/or the particle beam apparatus400 but rather may be spatially separated from the SEM 100, thecombination apparatus 200 and/or the particle beam apparatus 400. Oncethe processing of the object 158, 159 has been completed, the secondcontainer unit 130 optionally may be moved into the second positionrelative to the first container unit 129 such that, in particular, thefirst cavity 131 and/or the second cavity 132, in which the object 158,159 is arranged, are/is sealed and the object 158, 159 is no longeraccessible.

In method step S12, the transportation device and hence the objectreceiving container 125 arranged at the holding device 114 may bearranged in the SEM 100, the combination apparatus 200 and/or theparticle beam apparatus 400. Subsequently, the object 158, 159 may beexamined, analyzed and/or processed in method step S13. To this end,should the second container unit 130 be situated in the second positionrelative to the first container unit 129, the second container unit 130may be moved relative to the first container unit 129 in such a way thatthe second container unit 130 may be arranged in the first positionrelative to the first container unit 129. In the first position of thesecond container unit 130, the object 158, 159 arranged, for example, inthe first cavity 131 or in the second cavity 132 may be accessible andmay be examined, analyzed and/or processed. By way of example, layersmight be applied to the object 158, 159 by electron beam-induceddeposition or ion beam-induced deposition, for example using a gas. Inaddition or as an alternative thereto, layers of the object 158, 159 maybe ablated by means of the ion beam. In addition or as an alternativethereto, the object 158, 159 may be imaged by means of the electron beamand/or the ion beam. Yet again in addition or as an alternative thereto,interaction radiation, in particular x-rays, may be detected and usedfor analyzing the object 158, 159.

After completing the examination, the analysis and/or the processing ofthe object 158, 159, the second container unit 130 may be brought intothe second position relative to the first container unit 129 in methodstep S14 such that, in particular, the first cavity 131 and the secondcavity 132, in which the object 158, 159 may be arranged, are/is sealedand the object 158, 159 is no longer accessible. The transportationdevice may be removed from the SEM 100, the combination apparatus 200and/or the particle beam apparatus 400 again. In method step S15, theholding device 114 may be removed from the transportation device.Moreover, the object receiving container 125 may be removed from theholding device 114 again in method step S16. In method step S17, theobject receiving container 125 may be introduced into the transportationcontainer. As an alternative thereto, the object 158, 159 may be removedfrom the object receiving container 125 together with its holder and maybe arranged in a sample container. The sample container in turn may bearranged in a Dewar filled with nitrogen. The sample container may bestored therein until the object is examined, analyzed and/or processedfurther.

In one embodiment of the method according to the system describedherein, the object receiving container 125 may be introduced into thecombination apparatus 200. In this embodiment, regions on the object maybe identified in method step S13 by a superposition of imagerepresentations, which were created, firstly, with the light microscope800 and, secondly, with the SEM 100. In addition or as an alternativethereto, these regions may be identified by imaging with the SEM 100 orthe ion beam apparatus 300. Further, provision may be made, for example,for a precursor material to be arranged at these regions, in particularby ion beam-induced deposition, for example using a gas. The precursormaterial may serve the protection of the identified regions inparticular. Subsequently, material of the object 158, 159 may be ablatedin the identified regions using the ion beam apparatus 300 until theobject 158, 159 may have a thickness of approximately 300 nm to 500 nm.Subsequently, material of the object 158, 159 may be ablated in theidentified regions using the ion beam apparatus 300 until the object158, 159 may have a thickness of 200 nm or less. If the transportationdevice, and hence also the object receiving container 125, may beremoved from the sample chamber 201 of the combination apparatus 200,the transportation device may be introduced into the aforementionedworkstation together with the holding device 114 in order to apply amaterial layer to the object 158, 159 by means of a sputtering device soas to reduce the charging of the object 158, 159 during a subsequentexamination by means of a TEM.

In a further embodiment of the method according to the system describedherein, in which the object receiving container 125 is introduced in thecombination apparatus 200, a portion of the object 158, 159 of interestmay be cut out of the object 158, 159 by means of the ion beam apparatus300 and fastened to a manipulator. By means of the manipulator, theportion of interest may be lifted out of the object 158, 159 andfastened to a TEM object holder, which may be arranged at the objectreceiving container 125. At least one of the method steps alreadydescribed further above may be carried out in this embodiment. Theportion of interest may be examined in a TEM.

Explicit reference is made to the fact that before each method stepduring which the object 158, 159 arranged at the object receivingcontainer 125 must be accessible, the second container unit 130 may bebrought into the first position relative to the first container unit 129such that, in particular, the first cavity 131 and/or the second cavity132, in which the object 158, 159 may be arranged, may be opened and theobject 158, 159 may be accessible. If the object receiving container 125is transported, then the second container unit 130 may be brought intothe second position relative to the first container unit 129 such that,in particular, the first cavity 131 and/or the second cavity 132, inwhich the object 158, 159 may be arranged, may be sealed and the object158, 159 may not be accessible.

The object receiving container 125 allows safe and simple transportationbetween two examination apparatuses. In particular, the object receivingcontainer 125 may ensure protection against contamination of the object158, 159 arranged in, for example, the first cavity 131 and/or thesecond cavity 132 on account of the relative movement of the secondcontainer unit 130 with respect to the first container unit 129 into thesecond position and on account of the cover obtained therewith.Moreover, the object receiving container 125 may ensure that the object158, 159 may be stored safely over a relatively long period of time, forexample multiple days or months. Since the object 158, 159 need not beremoved from the object receiving container 125 during storage, forexample in a nitrogen-cooled storage container, the orientation of theobject 158, 159 in the object receiving container 125 does not change.This simplifies a subsequent examination of the object 158, 159 by meansof an examination apparatus since the object receiving container 125 maybe insertable into the examination apparatus after removing the objectreceiving container 125 from the storage container, with the orientationof the object 158, 159 already known. In particular, information aboutthe alignment and orientation of the object 158, 159 may be arranged atthe object receiving container 125 by means of a marking. Further, theobject receiving container 125 may ensure that the latter may bearranged in as many different examination apparatuses as possible. Theobject receiving container 125 may be arranged at the holding device114. The holding device 114 may be configured in such a way that, bymeans of the holding device 114, the object receiving container 125 maybe arranged a receiving device, for example the object stage 122, 424 ofthe SEM 100, of the combination apparatus 200, of the particle beamapparatus 400, of the light microscope 800, of the mounting device 147,and/or at the aforementioned workstation. In contrast to the prior art,the system described herein consequently makes it possible for theobject 158, 159 to not have to be arranged at respective differentobject holders, which have a physical configuration specified for arespective apparatus, for the purposes of examining and/or processingthe object 158, 159 in different apparatuses. Rather, the systemdescribed herein may provide for the object 158, 159 to be arranged onlyonce at the object receiving container 125 according to the systemdescribed herein, which then may be receivable in the variousexamination apparatuses.

The system described herein may ensure that an object 158, 159 arrangedin the object receiving container 125 is easily examinable, analyzableand/or processable with different work procedures undercryo-temperatures. By way of example, the object receiving container 125may be used to examine and/or analyze the object 158, 159 by means ofx-ray spectroscopy, by means of near field scanning microscopy, by meansof atomic force microscopy, by means of the combination apparatus 200,by means of transmission electron microscopy, by means of Ramanspectroscopy and/or by means of secondary ion mass spectrometry. Inaddition or as an alternative thereto, the object receiving container125 may be used when polishing the object 158, 159, when cutting theobject 158, 159 by means of a blade or a laser and/or when applyingmaterials to the object 158, 159. The aforementioned lists should beunderstood to be illustrative. The object receiving container 125 may beused for any desired and suitable method.

FIG. 24 shows an embodiment of a further mounting device 147A, by meansof which, for example, the first object may be arranged in the firstcavity 131 and the second object may be arranged in the second cavity132 of the object receiving container 125 as per FIGS. 7 to 10. Themounting device 147A may have an interior 148A, which may be surroundedby an insulated wall 149A. A holder 150A for the object receivingcontainer 125 may be arranged in the interior 148A. The object receivingcontainer 125 may be arranged in a receptacle 154A of the holder 150A inorder to mount the first object in the first cavity 131 and the secondobject in the second cavity 132 of the object receiving container 125.The object receiving container 125 may be fastened in the receptacle154A by means of the fastening device 133. To this end, an actuationtool engages in the first engagement opening 143 of the first spring end141 and in the second engagement opening 144 of the second spring end142 (cf. FIGS. 7 to 9). Thereupon, the first spring end 141 and thesecond spring end 142 may be moved toward one another. Subsequently, theobject receiving container 125 may be inserted into the receptacle 154A.By removing the actuation tool from the first engagement opening 143 ofthe first spring end 141 and from the second engagement opening 144 ofthe second spring end 142, the first spring end 141 and the secondspring end 142 move apart, and so an outer surface of the fasteningdevice 133 rests against an inner surface of the receptacle 154A. Inthis way, the object receiving container 125 may be held in clampingfashion in the receptacle 154A.

By filling the interior 148A of the mounting device 147A, for examplewith liquid nitrogen or liquid helium, the object receiving container125 may be cooled to cryo-temperatures, and so the first object may bemounted in the first cavity 131 and the second object may be mounted inthe second cavity 132 of the object receiving container 125 undercryo-temperatures. To this end, the clamping unit 135 embodied as aspring may be raised by a rod-shaped unit (not illustrated in FIG. 24).By way of example, the rod-shaped unit may be raised and lowered bymeans of a sliding-block guide by moving an actuation unit 157A (cf.FIG. 25). Subsequently, the holder 150A may be rotated through apredefinable angle. By way of example, the holder 150A may be rotated insuch a way (cf. FIG. 26) that the object receiving container 125 may beoriented in such a way that the first object is insertable into asliding device 170A and slides into the first cavity 131 under theaction of gravity. To this end, the first object may be taken from astorage container 171A and placed against and inserted into the slidingdevice 170A. Further, the second object is taken from the storagecontainer 171A and inserted into the sliding device 170A. The secondobject slides into the second cavity 132 under the action of gravity. Inparticular, the object receiving container 125 may be oriented in such away that the first object slides into the first cavity 131 insubstantially vertical fashion or in vertical fashion from the slidingdevice 170A. In particular, the object receiving container 125 may beoriented in such a way that the second object slides into the secondcavity 132 in substantially vertical fashion or in vertical fashion fromthe sliding device 170A. Subsequently, the clamping unit 135 may belowered by the rod-shaped unit 155, and so the first object is held insecurely clamping fashion in the first cavity 131 and the second objectis held in securely clamping fashion in the second cavity 132 of theobject receiving container 125.

In one embodiment, the holder 150A may subsequently be rotated into theoriginal position through the predefinable angle again. By way ofexample, the object receiving container 125 then may be arranged at theholding device 114 or at a further holding device 114A (cf. FIG. 24).The holding device 114 and the further holding device 114A differ fromone another in terms of the physical configuration. By way of example,the holding device 114 may only be used in a first examination, analysisand/or processing apparatus. By contrast, the further holding device114A may only be used in a second examination, analysis and/orprocessing apparatus. As an alternative thereto, the object receivingcontainer 125 may be inserted in a transportation box 172A. Thetransportation box 172A then may be sealed with a lid 173A, which may bearranged at the holding device 150A.

The features of the system described herein, in the written descriptionof the specification, drawings and the claims, may be essential for therealization of the invention in the various embodiments thereof, bothindividually and in arbitrary combinations. The invention is notrestricted to the described embodiments. It may be varied within thescope of the claims and taking into account the knowledge of therelevant person skilled in the art. Other embodiments of the inventionwill be apparent to those skilled in the art from a consideration of thespecification and/or an attempt to put into practice the systemdescribed herein. It is intended that the specification and examples beconsidered as illustrative only, with the true scope and spirit of theinvention being indicated by the following claims.

1. An object receiving container for receiving at least one object which is examinable, analyzable and/or processable at cryo-temperatures, comprising: at least one first container unit; at least one cavity for receiving the object, wherein the cavity is arranged at the first container unit; at least one second container unit, which is embodied to be movable relative to the first container unit, wherein the second container unit is able to be brought into a first position and/or into a second position relative to the first container unit, wherein the second container unit in the second position covers the cavity arranged at the first container unit; and at least one fastening device which is arranged at the first container unit or at the second container unit for arranging the object receiving container at a holding device.
 2. The object receiving container as claimed in claim 1, wherein the second container unit is arranged at a displacing device in such a way that the second container unit is able to be displaced into the first position and/or into the second position relative to the first container unit.
 3. The object receiving container as claimed in claim 1, wherein the object receiving container comprises at least one hinge device which is arranged both at the first container unit and at the second container unit in such a way that the second container unit is able to be brought into the first position and/or into the second position relative to the first container unit.
 4. The object receiving container as claimed in claim 1, wherein the object receiving container comprises one of the following features: (i) the fastening device includes a spring device; (ii) the fastening device includes a clamping device; (iii) the fastening device includes a first clamping part and a second clamping part; (iv) the fastening device includes a snap ring; (v) the fastening device includes a screw; and (vi) the fastening device includes an eccentric disk.
 5. The object receiving container as claimed in claim 1, wherein: the fastening device has at least one first spring end and at least one second spring end, the first spring end and the second spring end are arranged at a distance from one another, and the first spring end is embodied so as to be movable relative to the second spring end.
 6. The object receiving container as claimed in claim 5, wherein: the first spring end has a first engagement opening for the engagement of an actuation tool, and the second spring end has a second engagement opening for the engagement of the actuation tool.
 7. The object receiving container as claimed in claim 1, wherein: the first container unit has a first surface, wherein the first surface is arranged in a first plane, the second container unit has a second surface, wherein the second surface is arranged in a second plane, in the second position of the second container unit relative to the first container unit, the first surface of the first container unit rests against the second surface of the second container unit in such a way that the cavity is covered by the second surface of the second container unit, and in the first position of the second container unit relative to the first container unit, the first surface of the first container unit is arranged with respect to the second surface of the second container unit in such a way that the first plane is aligned with respect to the second plane as follows: (i) the first plane is aligned parallel to the second plane; or (ii) the first plane is identical to the second plane; or (iii) the first plane is aligned at an angle of more than 5° with respect to the second plane.
 8. The object receiving container as claimed in claim 1, wherein: the cavity has at least one first cavity opening and at least one second cavity opening, the second container unit covers the first cavity opening in the second position of the second container unit relative to the first container unit, and a covering device for covering the second cavity opening is arranged at the second cavity opening.
 9. The object receiving container as claimed in claim 8, wherein the first cavity opening and the second cavity opening are arranged opposite one another.
 10. The object receiving container as claimed in claim 8, wherein the covering device is embodied as a sliding device.
 11. An object holding system comprising: at least one object receiving container for receiving at least one object which is examinable, analyzable and/or processable at cryo-temperatures, including: at least one first container unit, at least one cavity for receiving the object, wherein the cavity is arranged at the first container unit, at least one second container unit, which is embodied to be movable relative to the first container unit, wherein the second container unit is able to be brought into a first position and/or into a second position relative to the first container unit, wherein the second container unit in the second position covers the cavity arranged at the first container unit, and at least one fastening device which is arranged at the first container unit or at the second container unit for arranging the object receiving container at a holding device; and at least one holding device, which comprises a receptacle, wherein the fastening device of the object receiving container is arranged at the receptacle.
 12. A beam apparatus for imaging, analyzing and/or processing an object, comprising: at least one beam generator for generating a beam; at least one objective lens for focusing the beam onto the object; at least one display device for displaying an image and/or an analysis of the object; at least one cooling device for cooling the object to cryo-temperatures; and at least one object receiving container, for receiving at least one object, wherein the at least one object is examinable, analyzable and/or processable at cryo-temperatures, wherein the at least one object receiving container is arranged at the cooling device and includes: at least one first container unit, at least one cavity for receiving the object, wherein the cavity is arranged at the first container unit, at least one second container unit, which is embodied to be movable relative to the first container unit, wherein the second container unit is able to be brought into a first position and/or into a second position relative to the first container unit, wherein the second container unit in the second position covers the cavity arranged at the first container unit, and at least one fastening device which is arranged at the first container unit or at the second container unit for arranging the object receiving container at a holding device.
 13. A beam apparatus for imaging, analyzing and/or processing an object, comprising at least one beam generator for generating a beam, at least one objective lens for focusing the beam onto the object, at least one display device for displaying an image and/or an analysis of the object, at least one cooling device for cooling the object to cryo-temperatures, and comprising at least one object holding system, which is arranged at the cooling device, the at least one object holding system including: at least one object receiving container for receiving at least one object which is examinable, analyzable and/or processable at cryo-temperatures, including: at least one first container unit, at least one cavity for receiving the object, wherein the cavity is arranged at the first container unit, at least one second container unit, which is embodied to be movable relative to the first container unit, wherein the second container unit is able to be brought into a first position and/or into a second position relative to the first container unit, wherein the second container unit in the second position covers the cavity arranged at the first container unit, and at least one fastening device which is arranged at the first container unit or at the second container unit for arranging the object receiving container at a holding device; and at least one holding device, which comprises a receptacle, wherein the fastening device of the object receiving container is arranged at the receptacle.
 14. The beam apparatus as claimed in claim 12, wherein: the beam apparatus is embodied as a particle beam apparatus, the beam generator is embodied to generate a particle beam with charged particles, the beam apparatus comprises at least one scanning device for scanning the particle beam over the object, and the beam apparatus comprises at least one detector for detecting interaction particles and/or interaction radiation, which result/results from an interaction of the particle beam with the object.
 15. The beam apparatus as claimed in claim 14, wherein the beam generator is embodied as a first beam generator and the particle beam is embodied as a first particle beam with first charged particles, wherein the objective lens is embodied as a first objective lens for focusing the first particle beam onto the object, and wherein the particle beam apparatus further comprises: at least one second beam generator for generating a second particle beam with second charged particles; and at least one second objective lens for focusing the second particle beam onto the object.
 16. The beam apparatus as claimed in claim 14 or 15, wherein the beam apparatus is an electron beam apparatus and/or an ion beam apparatus.
 17. The beam apparatus as claimed in claim 12, wherein: the beam apparatus is a light beam apparatus, and the beam generator is embodied to generate light beams.
 18. An apparatus for processing an object, comprising: at least one processing device for processing the object; at least one cooling device for cooling the object to cryo-temperatures; and either at least one object receiving container arranged at the cooling device, or at least one object holding system arranged at the cooling device, wherein the at least one object receiving container is for receiving at least one object, which is examinable, analyzable and/or processable at cryo-temperatures, and comprises: at least one first container unit; at least one cavity for receiving the object, wherein the cavity is arranged at the first container unit; at least one second container unit, which is embodied to be movable relative to the first container unit, wherein the second container unit is able to be brought into a first position and/or into a second position relative to the first container unit, wherein the second container unit in the second position covers the cavity arranged at the first container unit; and at least one fastening device which is arranged at the first container unit or at the second container unit for arranging the object receiving container at a holding device, and wherein the at least one object holding system comprises: the at least one object receiving container, and at least one holding device, which comprises a receptacle, wherein the fastening device of the object receiving container is arranged at the receptacle.
 19. The apparatus as claimed in claim 18, wherein the processing device is embodied as one or more of the following: (i) as a mechanical cutting device; and (ii) as a laser cutting device; and (iii) as a device for electron beam-induced deposition of layers on the object; and (iv) as a device for ion beam-induced deposition of layers on the object; and (v) as a sputtering apparatus.
 20. A method of examining, analyzing and/or processing an object at cryo-temperatures, comprising one of the following: (i) using an object receiving container; (ii) using an object holding system; (iii) using a beam apparatus; and (iv) using an apparatus for processing an object, wherein the object receiving container is for receiving at least one object, which is examinable, analyzable and/or processable at cryo-temperatures, and comprises: at least one first container unit; at least one cavity for receiving the object, wherein the cavity is arranged at the first container unit; at least one second container unit, which is embodied to be movable relative to the first container unit, wherein the second container unit is able to be brought into a first position and/or into a second position relative to the first container unit, wherein the second container unit in the second position covers the cavity arranged at the first container unit; and at least one fastening device which is arranged at the first container unit or at the second container unit for arranging the object receiving container at a holding device, wherein the object holding system comprises: the at least one object receiving container; and at least one holding device, which comprises a receptacle, wherein the fastening device of the object receiving container is arranged at the receptacle, wherein the beam apparatus comprises: at least one beam generator for generating a beam; at least one objective lens for focusing the beam onto the object; at least one display device for displaying an image and/or an analysis of the object; at least one cooling device for cooling the object to cryo-temperatures; and the object receiving container arranged at the cooling device, and wherein the apparatus comprises: at least one processing device for processing the object; at least one cooling device for cooling the object to cryo-temperatures; and either the object receiving container arranged at the cooling device or the object holding system arranged at the cooling device.
 21. The method as claimed in claim 20, further comprising: moving the second container unit relative to the first container unit in such a way that the second container unit adopts the first position relative to the first container unit and that the cavity arranged at the first container unit is accessible; arranging the object in the cavity; moving the second container unit relative to the first container unit in such a way that the second container unit adopts the second position and that the cavity arranged in the first container unit is covered by the second container unit; arranging the object receiving container at the holding device by arranging the fastening device of the object receiving container at the receptacle of the holding device in such a way that the fastening device is held at the receptacle; introducing the holding device into the beam apparatus or the apparatus for processing the object; arranging the holding device at the cooling device; moving the second container unit relative to the first container unit in such a way that the second container unit adopts the first position and that the object arranged in the cavity is accessible; and examining, analyzing and/or processing the object using the beam apparatus or using the apparatus for processing the object.
 22. The method as claimed in claim 21, comprising: arranging the holding device at a transportation device; introducing the transportation device into the beam apparatus; and arranging the transportation device at the cooling device.
 23. The method as claimed in claim 20, further comprising: moving the covering device in relative fashion for covering or exposing the second cavity opening. 